Global Through-Silicon Via (TSV) IC Packaging Market by End User (Industrial, Aerospace & Defense, Automotive, Oil & Gas, Healthcare, Paper & Pulp, Consumer Electronics), by Platform Type (3D TSV Platform, 2.5D TSV Platform), by Application (DRAM [Dynamic Random-Access Memory], Graphics Chips, Integrated Circuits, Memory Arrays, Image Sensors, MPUs [Microprocessor Units]) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028
Up Market Research published a new report titled “Through-Silicon Via (TSV) IC Packaging Market research report which is segmented by End User (Industrial, Aerospace & Defense, Automotive, Oil & Gas, Healthcare, Paper & Pulp, Consumer Electronics), by Platform Type (3D TSV Platform, 2.5D TSV Platform), by Application (DRAM [Dynamic Random-Access Memory], Graphics Chips, Integrated Circuits, Memory Arrays, Image Sensors, MPUs [Microprocessor Units]), By Players/Companies International Business Machines Corporation, Applied Materials, Renesas Electronics Corporation, Amkor Micralyne Inc., STATS ChipPAC Ltd, Micralyne Inc., Texas Instruments, Tezzaron Semiconductors, Xilinx., Intel Corporation”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.
Report Scope
| Report Attributes | Report Details |
| Report Title | Through-Silicon Via (TSV) IC Packaging Market Research Report |
| By End User | Industrial, Aerospace & Defense, Automotive, Oil & Gas, Healthcare, Paper & Pulp, Consumer Electronics |
| By Platform Type | 3D TSV Platform, 2.5D TSV Platform |
| By Application | DRAM [Dynamic Random-Access Memory], Graphics Chips, Integrated Circuits, Memory Arrays, Image Sensors, MPUs [Microprocessor Units] |
| By Companies | International Business Machines Corporation, Applied Materials, Renesas Electronics Corporation, Amkor Micralyne Inc., STATS ChipPAC Ltd, Micralyne Inc., Texas Instruments, Tezzaron Semiconductors, Xilinx., Intel Corporation |
| Regions Covered | North America, Europe, APAC, Latin America, MEA |
| Base Year | 2020 |
| Historical Year | 2018 to 2019 (Data from 2010 can be provided as per availability) |
| Forecast Year | 2028 |
| Number of Pages | 204 |
| Number of Tables & Figures | 143 |
| Customization Available | Yes, the report can be customized as per your need. |
The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.
Global Through-Silicon Via (TSV) IC Packaging Market Report Segments:
The market is segmented by End User (Industrial, Aerospace & Defense, Automotive, Oil & Gas, Healthcare, Paper & Pulp, Consumer Electronics), by Platform Type (3D TSV Platform, 2.5D TSV Platform), by Application (DRAM [Dynamic Random-Access Memory], Graphics Chips, Integrated Circuits, Memory Arrays, Image Sensors, MPUs [Microprocessor Units]).
Some of the companies that are profiled in this report are:
- International Business Machines Corporation
- Applied Materials
- Renesas Electronics Corporation
- Amkor Micralyne Inc.
- STATS ChipPAC Ltd
- Micralyne Inc.
- Texas Instruments
- Tezzaron Semiconductors
- Xilinx.
- Intel Corporation
Through-Silicon Via (TSV) IC Packaging Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.
Key Benefits for Industry Participants & Stakeholders:
- Industry drivers, restraints, and opportunities covered in the study
- Neutral perspective on the market performance
- Recent industry trends and developments
- Competitive landscape & strategies of key players
- Potential & niche segments and regions exhibiting promising growth covered
- Historical, current, and projected market size, in terms of value
- In-depth analysis of the Through-Silicon Via (TSV) IC Packaging Market
Overview of the regional outlook of the Through-Silicon Via (TSV) IC Packaging Market:
Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.
Highlights of The Through-Silicon Via (TSV) IC Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of Through-Silicon Via (TSV) IC Packaging Market.
- Historical data and forecast.
- Estimations for the forecast period 2028.
- Developments and trends in the market.
1. Industrial
2. Aerospace & Defense
3. Automotive
4. Oil & Gas
5. Healthcare
6. Paper & Pulp
7. Consumer Electronics
7. By Platform Type:1. 3D TSV Platform
2. 2.5D TSV Platform
8. By Application:1. DRAM [Dynamic Random-Access Memory]
2. Graphics Chips
3. Integrated Circuits
4. Memory Arrays
5. Image Sensors
6. MPUs [Microprocessor Units]
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Through-Silicon Via (TSV) IC Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
Reasons to Purchase the Through-Silicon Via (TSV) IC Packaging Market Report:
- The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
- Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
- Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
- The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
- Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Through-Silicon Via (TSV) IC Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Through-Silicon Via (TSV) IC Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Through-Silicon Via (TSV) IC Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Through-Silicon Via (TSV) IC Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Through-Silicon Via (TSV) IC Packaging Market Size & Forecast, 2018-2028
4.5.1 Through-Silicon Via (TSV) IC Packaging Market Size and Y-o-Y Growth
4.5.2 Through-Silicon Via (TSV) IC Packaging Market Absolute $ Opportunity
Chapter 5 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by End User
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by End User
5.1.2 Basis Point Share (BPS) Analysis by End User
5.1.3 Absolute $ Opportunity Assessment by End User
5.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
5.2.1 Industrial
5.2.2 Aerospace & Defense
5.2.3 Automotive
5.2.4 Oil & Gas
5.2.5 Healthcare
5.2.6 Paper & Pulp
5.2.7 Consumer Electronics
5.3 Market Attractiveness Analysis by End User
Chapter 6 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by Platform Type
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Platform Type
6.1.2 Basis Point Share (BPS) Analysis by Platform Type
6.1.3 Absolute $ Opportunity Assessment by Platform Type
6.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
6.2.1 3D TSV Platform
6.2.2 2.5D TSV Platform
6.3 Market Attractiveness Analysis by Platform Type
Chapter 7 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by Application
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Application
7.1.2 Basis Point Share (BPS) Analysis by Application
7.1.3 Absolute $ Opportunity Assessment by Application
7.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
7.2.1 DRAM [Dynamic Random-Access Memory]
7.2.2 Graphics Chips
7.2.3 Integrated Circuits
7.2.4 Memory Arrays
7.2.5 Image Sensors
7.2.6 MPUs [Microprocessor Units]
7.3 Market Attractiveness Analysis by Application
Chapter 8 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by Region
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Region
8.1.2 Basis Point Share (BPS) Analysis by Region
8.1.3 Absolute $ Opportunity Assessment by Region
8.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Region
8.2.1 North America
8.2.2 Europe
8.2.3 Asia Pacific
8.2.4 Latin America
8.2.5 Middle East & Africa (MEA)
8.3 Market Attractiveness Analysis by Region
Chapter 9 Coronavirus Disease (COVID-19) Impact
9.1 Introduction
9.2 Current & Future Impact Analysis
9.3 Economic Impact Analysis
9.4 Government Policies
9.5 Investment Scenario
Chapter 10 North America Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
10.1 Introduction
10.2 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
10.2.1 U.S.
10.2.2 Canada
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
10.6.1 Industrial
10.6.2 Aerospace & Defense
10.6.3 Automotive
10.6.4 Oil & Gas
10.6.5 Healthcare
10.6.6 Paper & Pulp
10.6.7 Consumer Electronics
10.7 Basis Point Share (BPS) Analysis by End User
10.8 Absolute $ Opportunity Assessment by End User
10.9 Market Attractiveness Analysis by End User
10.10 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
10.10.1 3D TSV Platform
10.10.2 2.5D TSV Platform
10.11 Basis Point Share (BPS) Analysis by Platform Type
10.12 Absolute $ Opportunity Assessment by Platform Type
10.13 Market Attractiveness Analysis by Platform Type
10.14 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
10.14.1 DRAM [Dynamic Random-Access Memory]
10.14.2 Graphics Chips
10.14.3 Integrated Circuits
10.14.4 Memory Arrays
10.14.5 Image Sensors
10.14.6 MPUs [Microprocessor Units]
10.15 Basis Point Share (BPS) Analysis by Application
10.16 Absolute $ Opportunity Assessment by Application
10.17 Market Attractiveness Analysis by Application
Chapter 11 Europe Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
11.1 Introduction
11.2 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
11.2.1 Germany
11.2.2 France
11.2.3 Italy
11.2.4 U.K.
11.2.5 Spain
11.2.6 Russia
11.2.7 Rest of Europe
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
11.6.1 Industrial
11.6.2 Aerospace & Defense
11.6.3 Automotive
11.6.4 Oil & Gas
11.6.5 Healthcare
11.6.6 Paper & Pulp
11.6.7 Consumer Electronics
11.7 Basis Point Share (BPS) Analysis by End User
11.8 Absolute $ Opportunity Assessment by End User
11.9 Market Attractiveness Analysis by End User
11.10 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
11.10.1 3D TSV Platform
11.10.2 2.5D TSV Platform
11.11 Basis Point Share (BPS) Analysis by Platform Type
11.12 Absolute $ Opportunity Assessment by Platform Type
11.13 Market Attractiveness Analysis by Platform Type
11.14 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
11.14.1 DRAM [Dynamic Random-Access Memory]
11.14.2 Graphics Chips
11.14.3 Integrated Circuits
11.14.4 Memory Arrays
11.14.5 Image Sensors
11.14.6 MPUs [Microprocessor Units]
11.15 Basis Point Share (BPS) Analysis by Application
11.16 Absolute $ Opportunity Assessment by Application
11.17 Market Attractiveness Analysis by Application
Chapter 12 Asia Pacific Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
12.1 Introduction
12.2 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
12.2.1 China
12.2.2 Japan
12.2.3 South Korea
12.2.4 India
12.2.5 Australia
12.2.6 South East Asia (SEA)
12.2.7 Rest of Asia Pacific (APAC)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
12.6.1 Industrial
12.6.2 Aerospace & Defense
12.6.3 Automotive
12.6.4 Oil & Gas
12.6.5 Healthcare
12.6.6 Paper & Pulp
12.6.7 Consumer Electronics
12.7 Basis Point Share (BPS) Analysis by End User
12.8 Absolute $ Opportunity Assessment by End User
12.9 Market Attractiveness Analysis by End User
12.10 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
12.10.1 3D TSV Platform
12.10.2 2.5D TSV Platform
12.11 Basis Point Share (BPS) Analysis by Platform Type
12.12 Absolute $ Opportunity Assessment by Platform Type
12.13 Market Attractiveness Analysis by Platform Type
12.14 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
12.14.1 DRAM [Dynamic Random-Access Memory]
12.14.2 Graphics Chips
12.14.3 Integrated Circuits
12.14.4 Memory Arrays
12.14.5 Image Sensors
12.14.6 MPUs [Microprocessor Units]
12.15 Basis Point Share (BPS) Analysis by Application
12.16 Absolute $ Opportunity Assessment by Application
12.17 Market Attractiveness Analysis by Application
Chapter 13 Latin America Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
13.1 Introduction
13.2 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
13.2.1 Brazil
13.2.2 Mexico
13.2.3 Rest of Latin America (LATAM)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
13.6.1 Industrial
13.6.2 Aerospace & Defense
13.6.3 Automotive
13.6.4 Oil & Gas
13.6.5 Healthcare
13.6.6 Paper & Pulp
13.6.7 Consumer Electronics
13.7 Basis Point Share (BPS) Analysis by End User
13.8 Absolute $ Opportunity Assessment by End User
13.9 Market Attractiveness Analysis by End User
13.10 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
13.10.1 3D TSV Platform
13.10.2 2.5D TSV Platform
13.11 Basis Point Share (BPS) Analysis by Platform Type
13.12 Absolute $ Opportunity Assessment by Platform Type
13.13 Market Attractiveness Analysis by Platform Type
13.14 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
13.14.1 DRAM [Dynamic Random-Access Memory]
13.14.2 Graphics Chips
13.14.3 Integrated Circuits
13.14.4 Memory Arrays
13.14.5 Image Sensors
13.14.6 MPUs [Microprocessor Units]
13.15 Basis Point Share (BPS) Analysis by Application
13.16 Absolute $ Opportunity Assessment by Application
13.17 Market Attractiveness Analysis by Application
Chapter 14 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
14.1 Introduction
14.2 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
14.2.1 Saudi Arabia
14.2.2 South Africa
14.2.3 UAE
14.2.4 Rest of Middle East & Africa (MEA)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
14.6.1 Industrial
14.6.2 Aerospace & Defense
14.6.3 Automotive
14.6.4 Oil & Gas
14.6.5 Healthcare
14.6.6 Paper & Pulp
14.6.7 Consumer Electronics
14.7 Basis Point Share (BPS) Analysis by End User
14.8 Absolute $ Opportunity Assessment by End User
14.9 Market Attractiveness Analysis by End User
14.10 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
14.10.1 3D TSV Platform
14.10.2 2.5D TSV Platform
14.11 Basis Point Share (BPS) Analysis by Platform Type
14.12 Absolute $ Opportunity Assessment by Platform Type
14.13 Market Attractiveness Analysis by Platform Type
14.14 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
14.14.1 DRAM [Dynamic Random-Access Memory]
14.14.2 Graphics Chips
14.14.3 Integrated Circuits
14.14.4 Memory Arrays
14.14.5 Image Sensors
14.14.6 MPUs [Microprocessor Units]
14.15 Basis Point Share (BPS) Analysis by Application
14.16 Absolute $ Opportunity Assessment by Application
14.17 Market Attractiveness Analysis by Application
Chapter 15 Competition Landscape
15.1 Through-Silicon Via (TSV) IC Packaging Market: Competitive Dashboard
15.2 Global Through-Silicon Via (TSV) IC Packaging Market: Market Share Analysis, 2019
15.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
15.3.1 International Business Machines Corporation
15.3.2 Applied Materials
15.3.3 Renesas Electronics Corporation
15.3.4 Amkor Micralyne Inc.
15.3.5 STATS ChipPAC Ltd
15.3.6 Micralyne Inc.
15.3.7 Texas Instruments
15.3.8 Tezzaron Semiconductors
15.3.9 Xilinx.
15.3.10 Intel Corporation
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Through-Silicon Via (TSV) IC Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Through-Silicon Via (TSV) IC Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Through-Silicon Via (TSV) IC Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Through-Silicon Via (TSV) IC Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Through-Silicon Via (TSV) IC Packaging Market Size & Forecast, 2018-2028
4.5.1 Through-Silicon Via (TSV) IC Packaging Market Size and Y-o-Y Growth
4.5.2 Through-Silicon Via (TSV) IC Packaging Market Absolute $ Opportunity
Chapter 5 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by End User
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by End User
5.1.2 Basis Point Share (BPS) Analysis by End User
5.1.3 Absolute $ Opportunity Assessment by End User
5.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
5.2.1 Industrial
5.2.2 Aerospace & Defense
5.2.3 Automotive
5.2.4 Oil & Gas
5.2.5 Healthcare
5.2.6 Paper & Pulp
5.2.7 Consumer Electronics
5.3 Market Attractiveness Analysis by End User
Chapter 6 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by Platform Type
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Platform Type
6.1.2 Basis Point Share (BPS) Analysis by Platform Type
6.1.3 Absolute $ Opportunity Assessment by Platform Type
6.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
6.2.1 3D TSV Platform
6.2.2 2.5D TSV Platform
6.3 Market Attractiveness Analysis by Platform Type
Chapter 7 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by Application
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Application
7.1.2 Basis Point Share (BPS) Analysis by Application
7.1.3 Absolute $ Opportunity Assessment by Application
7.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
7.2.1 DRAM [Dynamic Random-Access Memory]
7.2.2 Graphics Chips
7.2.3 Integrated Circuits
7.2.4 Memory Arrays
7.2.5 Image Sensors
7.2.6 MPUs [Microprocessor Units]
7.3 Market Attractiveness Analysis by Application
Chapter 8 Global Through-Silicon Via (TSV) IC Packaging Market Analysis and Forecast by Region
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Region
8.1.2 Basis Point Share (BPS) Analysis by Region
8.1.3 Absolute $ Opportunity Assessment by Region
8.2 Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Region
8.2.1 North America
8.2.2 Europe
8.2.3 Asia Pacific
8.2.4 Latin America
8.2.5 Middle East & Africa (MEA)
8.3 Market Attractiveness Analysis by Region
Chapter 9 Coronavirus Disease (COVID-19) Impact
9.1 Introduction
9.2 Current & Future Impact Analysis
9.3 Economic Impact Analysis
9.4 Government Policies
9.5 Investment Scenario
Chapter 10 North America Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
10.1 Introduction
10.2 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
10.2.1 U.S.
10.2.2 Canada
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
10.6.1 Industrial
10.6.2 Aerospace & Defense
10.6.3 Automotive
10.6.4 Oil & Gas
10.6.5 Healthcare
10.6.6 Paper & Pulp
10.6.7 Consumer Electronics
10.7 Basis Point Share (BPS) Analysis by End User
10.8 Absolute $ Opportunity Assessment by End User
10.9 Market Attractiveness Analysis by End User
10.10 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
10.10.1 3D TSV Platform
10.10.2 2.5D TSV Platform
10.11 Basis Point Share (BPS) Analysis by Platform Type
10.12 Absolute $ Opportunity Assessment by Platform Type
10.13 Market Attractiveness Analysis by Platform Type
10.14 North America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
10.14.1 DRAM [Dynamic Random-Access Memory]
10.14.2 Graphics Chips
10.14.3 Integrated Circuits
10.14.4 Memory Arrays
10.14.5 Image Sensors
10.14.6 MPUs [Microprocessor Units]
10.15 Basis Point Share (BPS) Analysis by Application
10.16 Absolute $ Opportunity Assessment by Application
10.17 Market Attractiveness Analysis by Application
Chapter 11 Europe Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
11.1 Introduction
11.2 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
11.2.1 Germany
11.2.2 France
11.2.3 Italy
11.2.4 U.K.
11.2.5 Spain
11.2.6 Russia
11.2.7 Rest of Europe
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
11.6.1 Industrial
11.6.2 Aerospace & Defense
11.6.3 Automotive
11.6.4 Oil & Gas
11.6.5 Healthcare
11.6.6 Paper & Pulp
11.6.7 Consumer Electronics
11.7 Basis Point Share (BPS) Analysis by End User
11.8 Absolute $ Opportunity Assessment by End User
11.9 Market Attractiveness Analysis by End User
11.10 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
11.10.1 3D TSV Platform
11.10.2 2.5D TSV Platform
11.11 Basis Point Share (BPS) Analysis by Platform Type
11.12 Absolute $ Opportunity Assessment by Platform Type
11.13 Market Attractiveness Analysis by Platform Type
11.14 Europe Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
11.14.1 DRAM [Dynamic Random-Access Memory]
11.14.2 Graphics Chips
11.14.3 Integrated Circuits
11.14.4 Memory Arrays
11.14.5 Image Sensors
11.14.6 MPUs [Microprocessor Units]
11.15 Basis Point Share (BPS) Analysis by Application
11.16 Absolute $ Opportunity Assessment by Application
11.17 Market Attractiveness Analysis by Application
Chapter 12 Asia Pacific Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
12.1 Introduction
12.2 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
12.2.1 China
12.2.2 Japan
12.2.3 South Korea
12.2.4 India
12.2.5 Australia
12.2.6 South East Asia (SEA)
12.2.7 Rest of Asia Pacific (APAC)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
12.6.1 Industrial
12.6.2 Aerospace & Defense
12.6.3 Automotive
12.6.4 Oil & Gas
12.6.5 Healthcare
12.6.6 Paper & Pulp
12.6.7 Consumer Electronics
12.7 Basis Point Share (BPS) Analysis by End User
12.8 Absolute $ Opportunity Assessment by End User
12.9 Market Attractiveness Analysis by End User
12.10 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
12.10.1 3D TSV Platform
12.10.2 2.5D TSV Platform
12.11 Basis Point Share (BPS) Analysis by Platform Type
12.12 Absolute $ Opportunity Assessment by Platform Type
12.13 Market Attractiveness Analysis by Platform Type
12.14 Asia Pacific Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
12.14.1 DRAM [Dynamic Random-Access Memory]
12.14.2 Graphics Chips
12.14.3 Integrated Circuits
12.14.4 Memory Arrays
12.14.5 Image Sensors
12.14.6 MPUs [Microprocessor Units]
12.15 Basis Point Share (BPS) Analysis by Application
12.16 Absolute $ Opportunity Assessment by Application
12.17 Market Attractiveness Analysis by Application
Chapter 13 Latin America Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
13.1 Introduction
13.2 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
13.2.1 Brazil
13.2.2 Mexico
13.2.3 Rest of Latin America (LATAM)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
13.6.1 Industrial
13.6.2 Aerospace & Defense
13.6.3 Automotive
13.6.4 Oil & Gas
13.6.5 Healthcare
13.6.6 Paper & Pulp
13.6.7 Consumer Electronics
13.7 Basis Point Share (BPS) Analysis by End User
13.8 Absolute $ Opportunity Assessment by End User
13.9 Market Attractiveness Analysis by End User
13.10 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
13.10.1 3D TSV Platform
13.10.2 2.5D TSV Platform
13.11 Basis Point Share (BPS) Analysis by Platform Type
13.12 Absolute $ Opportunity Assessment by Platform Type
13.13 Market Attractiveness Analysis by Platform Type
13.14 Latin America Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
13.14.1 DRAM [Dynamic Random-Access Memory]
13.14.2 Graphics Chips
13.14.3 Integrated Circuits
13.14.4 Memory Arrays
13.14.5 Image Sensors
13.14.6 MPUs [Microprocessor Units]
13.15 Basis Point Share (BPS) Analysis by Application
13.16 Absolute $ Opportunity Assessment by Application
13.17 Market Attractiveness Analysis by Application
Chapter 14 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Analysis and Forecast
14.1 Introduction
14.2 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Country
14.2.1 Saudi Arabia
14.2.2 South Africa
14.2.3 UAE
14.2.4 Rest of Middle East & Africa (MEA)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by End User
14.6.1 Industrial
14.6.2 Aerospace & Defense
14.6.3 Automotive
14.6.4 Oil & Gas
14.6.5 Healthcare
14.6.6 Paper & Pulp
14.6.7 Consumer Electronics
14.7 Basis Point Share (BPS) Analysis by End User
14.8 Absolute $ Opportunity Assessment by End User
14.9 Market Attractiveness Analysis by End User
14.10 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Platform Type
14.10.1 3D TSV Platform
14.10.2 2.5D TSV Platform
14.11 Basis Point Share (BPS) Analysis by Platform Type
14.12 Absolute $ Opportunity Assessment by Platform Type
14.13 Market Attractiveness Analysis by Platform Type
14.14 Middle East & Africa (MEA) Through-Silicon Via (TSV) IC Packaging Market Size Forecast by Application
14.14.1 DRAM [Dynamic Random-Access Memory]
14.14.2 Graphics Chips
14.14.3 Integrated Circuits
14.14.4 Memory Arrays
14.14.5 Image Sensors
14.14.6 MPUs [Microprocessor Units]
14.15 Basis Point Share (BPS) Analysis by Application
14.16 Absolute $ Opportunity Assessment by Application
14.17 Market Attractiveness Analysis by Application
Chapter 15 Competition Landscape
15.1 Through-Silicon Via (TSV) IC Packaging Market: Competitive Dashboard
15.2 Global Through-Silicon Via (TSV) IC Packaging Market: Market Share Analysis, 2019
15.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
15.3.1 International Business Machines Corporation
15.3.2 Applied Materials
15.3.3 Renesas Electronics Corporation
15.3.4 Amkor Micralyne Inc.
15.3.5 STATS ChipPAC Ltd
15.3.6 Micralyne Inc.
15.3.7 Texas Instruments
15.3.8 Tezzaron Semiconductors
15.3.9 Xilinx.
15.3.10 Intel Corporation
Segments Covered in the Report
The global Through-Silicon Via (TSV) IC Packaging market has been segmented based on
By End User
The global Through-Silicon Via (TSV) IC Packaging market has been segmented based on
By End User
- Industrial
- Aerospace & Defense
- Automotive
- Oil & Gas
- Healthcare
- Paper & Pulp
- Consumer Electronics
- 3D TSV Platform
- 2.5D TSV Platform
- DRAM [Dynamic Random-Access Memory]
- Graphics Chips
- Integrated Circuits
- Memory Arrays
- Image Sensors
- MPUs [Microprocessor Units]
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
- International Business Machines Corporation
- Applied Materials
- Renesas Electronics Corporation
- Amkor Micralyne Inc.
- STATS ChipPAC Ltd
- Micralyne Inc.
- Texas Instruments
- Tezzaron Semiconductors
- Xilinx.
- Intel Corporation
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