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Global Passive And Interconnecting Electronic Components Market by Component Type (Interconnecting, Passive) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028

  • Report ID: ES-73660
  • Author: Up Market Research
  • Rating: 4.9
  • Total Reviews: 61
  • No. Of Pages: 244
  • Format:
  • Pub. Date: 2021-10-21
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Summary of the Report

Global passive and interconnecting electronics components market was worth USD 171.3 billion in 2019. It is projected to grow at a compound annual rate (CAGR of 5.3%) between 2020 and 2027. Electronic devices include smartphones, computers and gaming consoles. Passive and interconnecting components are an integral part of these electronic devices. The market for passive and interconnecting electronic parts is expected to grow due to the increasing adoption of smartphones in developing countries like India and China.

In key countries like the U.S. and China, the 5G network infrastructure has been rapidly deployed. With the upcoming 5G services and a growing demand for high-speed internet connectivity, 5G devices are in high demand around the world. According to UMR analysis, 5G device sales worldwide surpassed 10.0 million units in 2019. This figure is expected to rise significantly. The significant rise in demand for 5G devices across many verticals, such as automotive, industrial, and consumer electronics, is expected to increase the adoption of passive-interconnecting electronic components between 2020 and 2027.

The industrial sector is experiencing rapid transformation thanks to the widespread adoption of IoT devices. Manufacturing facilities can use the industrial IoT devices to increase their productivity and operational efficiency. They also provide ease of operation and reduce system downtime. Many manufacturing plants are implementing connected devices to improve their operational processes via remote monitoring, as part of the Fourth Industrial Revolution (Industrial 4.0). In the coming seven years, the market for passive and interconnecting electronic parts will grow because of robust deployment of IoT devices in many industrial applications like process automation and motion control.

China is one the world's top electronic goods exporters. China exported passive electronic components worth more than USD 50.0 trillion to global markets in 2018. The United States is also a major importer from China. In 2018, however, the U.S. placed around 25.0% tariffs on electronic goods made in China. The spread of Covid-19 appears to have had a negative effect on international trades and production. The market for passive and interconnecting electronic parts is expected to slow down between 2020-2021.

Component Type Insights

In 2019, the market share for capacitors was 35.0%. This is due to the large demand for capacitors in various applications, including industrial and consumer electronics. The transformers are essential for electronic devices' operation. They reduce the voltage to the voltage required by the circuit. The demand for transformers will grow rapidly in the future, due to the increasing production of various types of electronic devices (industrial digital, home, etc.)

Print circuit boards (PCB), switches, relays and connectors/sockets are all interconnecting components. Interconnecting electronic parts accounted for a large share of the market for passive and interconnecting components in 2019. This market is expected to grow at a remarkable rate over the forecast period. It is widely used in electronic devices like digital cameras and gaming consoles to transmit media and content. The continued demand for storage and networking devices in data centers will further boost connectors/sockets usage globally between 2020-2027. This will drive the market for passive electronic components and interconnecting electronic parts over the forecast period.

Application Insights

The market share for consumer electronics was 40.0% in 2019. It is expected to grow at a 5.2% CAGR during the forecast period. This is mainly due to the growing demand for passive and interconnecting parts for many consumer devices, including mobile phones, set-top boxes (STB), as well as home appliances. In addition, demand for sensor-based devices and robotics, such as security cameras and robots, is increasing rapidly in industrial applications like process automation and remote monitoring. It is expected to increase the market for passive and interconnecting electronic parts over the next seven year.

There is a growing demand for networking devices, such as repeaters, gateways, modems and gateways, particularly in the office automation and residential applications segments. As key telecom operators invest heavily to offer better bandwidth experiences to customers, 5G equipment is also rapidly becoming a reality. The market for passive and interconnecting electronic parts is expected to grow in the IT and telecommunication segments over the forecast period due to the increasing demand for telecom equipment and network devices. The automotive segment is expected to grow from 2020-2027 due to strong demand for infotainment and driver assistance systems and Global Positioning Systems (GPS) and other electronic systems used in automotive applications.

Regional Insights

Asia Pacific was the largest region for passive and interconnecting electronic parts in 2019, with a market value of USD 95.1 billion. This is largely due to the presence of large electronic product exporters and manufacturers in the region. The region's growth is expected to be boosted by the presence of major consumer electronics companies like Samsung Electronics Co. Ltd., BBK electronics, Foxconn Technology Group, and Xiaomi Corporation. The Covid19 epidemic has negatively affected prominent countries like Japan, South Korea and China. Covid-19 has affected trade (imports/exports) in many countries around the world.

Leading telecom companies such as Verizon Inc. and AT&T Inc. are investing large amounts in 5G network infrastructure to meet the rising demand for connected cars in the U.S. The next-generation 5G mobile network will provide unidirectional connectivity for vehicles connected to infrastructures throughout the country. The recent outbreak of Covid-19 is likely to delay the industrial deployment. The U.S. government has been spending huge amounts to build smart cities across the country. In the next few years, 5G network infrastructure will increase the number of new telecom equipment and other networking devices. This will drive the market for passive and interconnecting electronic parts.

Market Share Insights & Key Companies

To increase their product portfolios, key market players are investing heavily in developing innovative products. In March 2019, AVX Corporation launched a new line of surface-mount and J-lead tantalum capacitators. These capacitors offer improved reliability and volumetric efficacy in high-temperature automotive and industrial applications.

Strategically, the top manufacturers are focused on mergers & acquisitions which will help them increase their market share for passive and interconnecting electronic parts. Yageo Corporation purchased KEMET Corporation in November 2019 for USD 1.8 billion. Yageo Corporation will be able to increase its geographic presence by acquiring KEMET Corporation's 23 manufacturing plants and 4,000 employees in North America, Asia Pacific and Europe. The strategy will also increase Yageo Corporation's share in the capacitors market, as KEMET produces major products such as ceramic capacitors and tantalum capacitors. The market for passive and interconnecting electronic parts is dominated by the following players:

  • AVX Corporation

  • Vishay Intertechnology, Inc.

  • Mouser Electronics, Inc.

  • Murata Manufacturing Co., Ltd.

  • TDK Corporation

  • Taiyo Yuden Co., Ltd.

  • Samsung Electro-Mechanics

  • Hosiden Corporation

  • Yageo Corporation

  • Nichicon Corporation

  • Panasonic Corporation

  • Fujitsu Component Limited

  • Fenghua Electronics Ltd.

  • Rohm Co., Ltd.

  • United Chemi-Con

  • TE connectivity

  • Molex Incorporated

Up Market Research published a new report titled “Passive And Interconnecting Electronic Components Market research report which is segmented by Component Type (Interconnecting, Passive), By Players/Companies Panasonic Corporation, TDK Corporation, TE connectivity, Samsung Electro-Mechanics, United Chemi-Con, Murata Manufacturing Co Ltd, Hosiden Corporation, Vishay Intertechnology Inc, Nichicon Corporation, Fujitsu Component Limited, Molex Incorporated, Taiyo Yuden Co Ltd, AVX Corporation, Yageo Corporation, Fenghua (HK) Electronics Ltd, Rohm Co Ltd, Mouser Electronics Inc”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.


Report Scope

Report AttributesReport Details
Report TitlePassive And Interconnecting Electronic Components Market Research Report
By Component TypeInterconnecting, Passive
By CompaniesPanasonic Corporation, TDK Corporation, TE connectivity, Samsung Electro-Mechanics, United Chemi-Con, Murata Manufacturing Co Ltd, Hosiden Corporation, Vishay Intertechnology Inc, Nichicon Corporation, Fujitsu Component Limited, Molex Incorporated, Taiyo Yuden Co Ltd, AVX Corporation, Yageo Corporation, Fenghua (HK) Electronics Ltd, Rohm Co Ltd, Mouser Electronics Inc
Regions CoveredNorth America, Europe, APAC, Latin America, MEA
Base Year2020
Historical Year2018 to 2019 (Data from 2010 can be provided as per availability)
Forecast Year2028
Number of Pages244
Number of Tables & Figures171
Customization AvailableYes, the report can be customized as per your need.

The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.


Global Passive And Interconnecting Electronic Components Industry Outlook

Global Passive And Interconnecting Electronic Components Market Report Segments:

The market is segmented by Component Type (Interconnecting, Passive).

Passive And Interconnecting Electronic Components Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.


Key Benefits for Industry Participants & Stakeholders:

  • Industry drivers, restraints, and opportunities covered in the study
  • Neutral perspective on the market performance
  • Recent industry trends and developments
  • Competitive landscape & strategies of key players
  • Potential & niche segments and regions exhibiting promising growth covered
  • Historical, current, and projected market size, in terms of value
  • In-depth analysis of the Passive And Interconnecting Electronic Components Market

Overview of the regional outlook of the Passive And Interconnecting Electronic Components Market:

Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.


Passive And Interconnecting Electronic Components Market Overview

Highlights of The Passive And Interconnecting Electronic Components Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of Passive And Interconnecting Electronic Components Market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2028.
  5. Developments and trends in the market.
        6. By Component Type:

                1. Interconnecting

                2. Passive

  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Passive And Interconnecting Electronic Components Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.


How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
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  • Product & Brand Management
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Passive And Interconnecting Electronic Components Market Trends

Reasons to Purchase the Passive And Interconnecting Electronic Components Market Report:

  • The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
  • Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
  • Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
  • The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
  • Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Passive And Interconnecting Electronic Components Market Overview
   4.1 Introduction 
      4.1.1 Market Taxonomy 
      4.1.2 Market Definition 
      4.1.3 Macro-Economic Factors Impacting the Market Growth 
   4.2 Passive And Interconnecting Electronic Components Market Dynamics 
      4.2.1 Market Drivers 
      4.2.2 Market Restraints 
      4.2.3 Market Opportunity 
   4.3 Passive And Interconnecting Electronic Components Market - Supply Chain Analysis 
      4.3.1 List of Key Suppliers 
      4.3.2 List of Key Distributors 
      4.3.3 List of Key Consumers 
   4.4 Key Forces Shaping the Passive And Interconnecting Electronic Components Market 
      4.4.1 Bargaining Power of Suppliers 
      4.4.2 Bargaining Power of Buyers 
      4.4.3 Threat of Substitution 
      4.4.4 Threat of New Entrants 
      4.4.5 Competitive Rivalry 
   4.5 Global Passive And Interconnecting Electronic Components Market Size & Forecast, 2018-2028 
      4.5.1 Passive And Interconnecting Electronic Components Market Size and Y-o-Y Growth 
      4.5.2 Passive And Interconnecting Electronic Components Market Absolute $ Opportunity 


Chapter 5 Global Passive And Interconnecting Electronic Components Market Analysis and Forecast by Component Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Component Type
      5.1.2 Basis Point Share (BPS) Analysis by Component Type
      5.1.3 Absolute $ Opportunity Assessment by Component Type
   5.2 Passive And Interconnecting Electronic Components Market Size Forecast by Component Type
      5.2.1 Interconnecting
      5.2.2 Passive
   5.3 Market Attractiveness Analysis by Component Type

Chapter 6 Global Passive And Interconnecting Electronic Components Market Analysis and Forecast by Region
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Region
      6.1.2 Basis Point Share (BPS) Analysis by Region
      6.1.3 Absolute $ Opportunity Assessment by Region
   6.2 Passive And Interconnecting Electronic Components Market Size Forecast by Region
      6.2.1 North America
      6.2.2 Europe
      6.2.3 Asia Pacific
      6.2.4 Latin America
      6.2.5 Middle East & Africa (MEA)
   6.3 Market Attractiveness Analysis by Region

Chapter 7 Coronavirus Disease (COVID-19) Impact 
   7.1 Introduction 
   7.2 Current & Future Impact Analysis 
   7.3 Economic Impact Analysis 
   7.4 Government Policies 
   7.5 Investment Scenario

Chapter 8 North America Passive And Interconnecting Electronic Components Analysis and Forecast
   8.1 Introduction
   8.2 North America Passive And Interconnecting Electronic Components Market Size Forecast by Country
      8.2.1 U.S.
      8.2.2 Canada
   8.3 Basis Point Share (BPS) Analysis by Country
   8.4 Absolute $ Opportunity Assessment by Country
   8.5 Market Attractiveness Analysis by Country
   8.6 North America Passive And Interconnecting Electronic Components Market Size Forecast by Component Type
      8.6.1 Interconnecting
      8.6.2 Passive
   8.7 Basis Point Share (BPS) Analysis by Component Type 
   8.8 Absolute $ Opportunity Assessment by Component Type 
   8.9 Market Attractiveness Analysis by Component Type

Chapter 9 Europe Passive And Interconnecting Electronic Components Analysis and Forecast
   9.1 Introduction
   9.2 Europe Passive And Interconnecting Electronic Components Market Size Forecast by Country
      9.2.1 Germany
      9.2.2 France
      9.2.3 Italy
      9.2.4 U.K.
      9.2.5 Spain
      9.2.6 Russia
      9.2.7 Rest of Europe
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 Europe Passive And Interconnecting Electronic Components Market Size Forecast by Component Type
      9.6.1 Interconnecting
      9.6.2 Passive
   9.7 Basis Point Share (BPS) Analysis by Component Type 
   9.8 Absolute $ Opportunity Assessment by Component Type 
   9.9 Market Attractiveness Analysis by Component Type

Chapter 10 Asia Pacific Passive And Interconnecting Electronic Components Analysis and Forecast
   10.1 Introduction
   10.2 Asia Pacific Passive And Interconnecting Electronic Components Market Size Forecast by Country
      10.2.1 China
      10.2.2 Japan
      10.2.3 South Korea
      10.2.4 India
      10.2.5 Australia
      10.2.6 South East Asia (SEA)
      10.2.7 Rest of Asia Pacific (APAC)
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Asia Pacific Passive And Interconnecting Electronic Components Market Size Forecast by Component Type
      10.6.1 Interconnecting
      10.6.2 Passive
   10.7 Basis Point Share (BPS) Analysis by Component Type 
   10.8 Absolute $ Opportunity Assessment by Component Type 
   10.9 Market Attractiveness Analysis by Component Type

Chapter 11 Latin America Passive And Interconnecting Electronic Components Analysis and Forecast
   11.1 Introduction
   11.2 Latin America Passive And Interconnecting Electronic Components Market Size Forecast by Country
      11.2.1 Brazil
      11.2.2 Mexico
      11.2.3 Rest of Latin America (LATAM)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Latin America Passive And Interconnecting Electronic Components Market Size Forecast by Component Type
      11.6.1 Interconnecting
      11.6.2 Passive
   11.7 Basis Point Share (BPS) Analysis by Component Type 
   11.8 Absolute $ Opportunity Assessment by Component Type 
   11.9 Market Attractiveness Analysis by Component Type

Chapter 12 Middle East & Africa (MEA) Passive And Interconnecting Electronic Components Analysis and Forecast
   12.1 Introduction
   12.2 Middle East & Africa (MEA) Passive And Interconnecting Electronic Components Market Size Forecast by Country
      12.2.1 Saudi Arabia
      12.2.2 South Africa
      12.2.3 UAE
      12.2.4 Rest of Middle East & Africa (MEA)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Middle East & Africa (MEA) Passive And Interconnecting Electronic Components Market Size Forecast by Component Type
      12.6.1 Interconnecting
      12.6.2 Passive
   12.7 Basis Point Share (BPS) Analysis by Component Type 
   12.8 Absolute $ Opportunity Assessment by Component Type 
   12.9 Market Attractiveness Analysis by Component Type

Chapter 13 Competition Landscape 
   13.1 Passive And Interconnecting Electronic Components Market: Competitive Dashboard
   13.2 Global Passive And Interconnecting Electronic Components Market: Market Share Analysis, 2019
   13.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      13.3.1 Panasonic Corporation
      13.3.2 TDK Corporation
      13.3.3 TE connectivity
      13.3.4 Samsung Electro-Mechanics
      13.3.5 United Chemi-Con
      13.3.6 Murata Manufacturing Co Ltd
      13.3.7 Hosiden Corporation
      13.3.8 Vishay Intertechnology Inc
      13.3.9 Nichicon Corporation
      13.3.10 Fujitsu Component Limited
      13.3.11 Molex Incorporated
      13.3.12 Taiyo Yuden Co Ltd
      13.3.13 AVX Corporation
      13.3.14 Yageo Corporation
      13.3.15 Fenghua (HK) Electronics Ltd
      13.3.16 Rohm Co Ltd
      13.3.17 Mouser Electronics Inc
Segments Covered in the Report
The global Passive And Interconnecting Electronic Components market has been segmented based on

By Component Type
  • Interconnecting
  • Passive
Regions
  • Asia Pacific
  • North America
  • Latin America
  • Europe
  • Middle East & Africa
Key Players
  • Panasonic Corporation
  • TDK Corporation
  • TE connectivity
  • Samsung Electro-Mechanics
  • United Chemi-Con
  • Murata Manufacturing Co Ltd
  • Hosiden Corporation
  • Vishay Intertechnology Inc
  • Nichicon Corporation
  • Fujitsu Component Limited
  • Molex Incorporated
  • Taiyo Yuden Co Ltd
  • AVX Corporation
  • Yageo Corporation
  • Fenghua (HK) Electronics Ltd
  • Rohm Co Ltd
  • Mouser Electronics Inc

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