Global Fan-Out Wafer Level Packaging Market by Type (High Density Fan-Out, Core Fan-Out), by Carrier Type (200mm, Panel, 300mm), by Industry Vertical (Automotive, Aerospace & Defense, Industrial, IT & Telecommunication, Consumer Electronics, Healthcare), by Business Model (IDM, Foundry, OSAT) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028
Up Market Research published a new report titled “Fan-Out Wafer Level Packaging Market research report which is segmented by Type (High Density Fan-Out, Core Fan-Out), by Carrier Type (200mm, Panel, 300mm), by Industry Vertical (Automotive, Aerospace & Defense, Industrial, IT & Telecommunication, Consumer Electronics, Healthcare), by Business Model (IDM, Foundry, OSAT), By Players/Companies Powertech Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company, Amkor Technology, NXP Semiconductors NV, Samsung Electro-Mechanics, STATS ChipPAC, ASE Technology Holding, Renesas Electronics Corp., Cypress Semiconductor Corp.”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.
Report Scope
| Report Attributes | Report Details |
| Report Title | Fan-Out Wafer Level Packaging Market Research Report |
| By Type | High Density Fan-Out, Core Fan-Out |
| By Carrier Type | 200mm, Panel, 300mm |
| By Industry Vertical | Automotive, Aerospace & Defense, Industrial, IT & Telecommunication, Consumer Electronics, Healthcare |
| By Business Model | IDM, Foundry, OSAT |
| By Companies | Powertech Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company, Amkor Technology, NXP Semiconductors NV, Samsung Electro-Mechanics, STATS ChipPAC, ASE Technology Holding, Renesas Electronics Corp., Cypress Semiconductor Corp. |
| Regions Covered | North America, Europe, APAC, Latin America, MEA |
| Base Year | 2020 |
| Historical Year | 2018 to 2019 (Data from 2010 can be provided as per availability) |
| Forecast Year | 2028 |
| Number of Pages | 243 |
| Number of Tables & Figures | 171 |
| Customization Available | Yes, the report can be customized as per your need. |
The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.
Global Fan-Out Wafer Level Packaging Market Report Segments:
The market is segmented by Type (High Density Fan-Out, Core Fan-Out), by Carrier Type (200mm, Panel, 300mm), by Industry Vertical (Automotive, Aerospace & Defense, Industrial, IT & Telecommunication, Consumer Electronics, Healthcare), by Business Model (IDM, Foundry, OSAT).
Some of the companies that are profiled in this report are:
- Powertech Technology Inc.
- Infineon Technologies AG
- Taiwan Semiconductor Manufacturing Company
- Amkor Technology
- NXP Semiconductors NV
- Samsung Electro-Mechanics
- STATS ChipPAC
- ASE Technology Holding
- Renesas Electronics Corp.
- Cypress Semiconductor Corp.
Fan-Out Wafer Level Packaging Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.
Key Benefits for Industry Participants & Stakeholders:
- Industry drivers, restraints, and opportunities covered in the study
- Neutral perspective on the market performance
- Recent industry trends and developments
- Competitive landscape & strategies of key players
- Potential & niche segments and regions exhibiting promising growth covered
- Historical, current, and projected market size, in terms of value
- In-depth analysis of the Fan-Out Wafer Level Packaging Market
Overview of the regional outlook of the Fan-Out Wafer Level Packaging Market:
Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.
Highlights of The Fan-Out Wafer Level Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of Fan-Out Wafer Level Packaging Market.
- Historical data and forecast.
- Estimations for the forecast period 2028.
- Developments and trends in the market.
1. High Density Fan-Out
2. Core Fan-Out
7. By Carrier Type:1. 200mm
2. Panel
3. 300mm
8. By Industry Vertical:1. Automotive
2. Aerospace & Defense
3. Industrial
4. IT & Telecommunication
5. Consumer Electronics
6. Healthcare
9. By Business Model:1. IDM
2. Foundry
3. OSAT
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Fan-Out Wafer Level Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
Reasons to Purchase the Fan-Out Wafer Level Packaging Market Report:
- The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
- Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
- Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
- The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
- Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Fan-Out Wafer Level Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Fan-Out Wafer Level Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Fan-Out Wafer Level Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Fan-Out Wafer Level Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Fan-Out Wafer Level Packaging Market Size & Forecast, 2018-2028
4.5.1 Fan-Out Wafer Level Packaging Market Size and Y-o-Y Growth
4.5.2 Fan-Out Wafer Level Packaging Market Absolute $ Opportunity
Chapter 5 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Fan-Out Wafer Level Packaging Market Size Forecast by Type
5.2.1 High Density Fan-Out
5.2.2 Core Fan-Out
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Carrier Type
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Carrier Type
6.1.2 Basis Point Share (BPS) Analysis by Carrier Type
6.1.3 Absolute $ Opportunity Assessment by Carrier Type
6.2 Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
6.2.1 200mm
6.2.2 Panel
6.2.3 300mm
6.3 Market Attractiveness Analysis by Carrier Type
Chapter 7 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Industry Vertical
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
7.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
7.1.3 Absolute $ Opportunity Assessment by Industry Vertical
7.2 Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
7.2.1 Automotive
7.2.2 Aerospace & Defense
7.2.3 Industrial
7.2.4 IT & Telecommunication
7.2.5 Consumer Electronics
7.2.6 Healthcare
7.3 Market Attractiveness Analysis by Industry Vertical
Chapter 8 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Business Model
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Business Model
8.1.2 Basis Point Share (BPS) Analysis by Business Model
8.1.3 Absolute $ Opportunity Assessment by Business Model
8.2 Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
8.2.1 IDM
8.2.2 Foundry
8.2.3 OSAT
8.3 Market Attractiveness Analysis by Business Model
Chapter 9 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Region
9.1 Introduction
9.1.1 Key Market Trends & Growth Opportunities by Region
9.1.2 Basis Point Share (BPS) Analysis by Region
9.1.3 Absolute $ Opportunity Assessment by Region
9.2 Fan-Out Wafer Level Packaging Market Size Forecast by Region
9.2.1 North America
9.2.2 Europe
9.2.3 Asia Pacific
9.2.4 Latin America
9.2.5 Middle East & Africa (MEA)
9.3 Market Attractiveness Analysis by Region
Chapter 10 Coronavirus Disease (COVID-19) Impact
10.1 Introduction
10.2 Current & Future Impact Analysis
10.3 Economic Impact Analysis
10.4 Government Policies
10.5 Investment Scenario
Chapter 11 North America Fan-Out Wafer Level Packaging Analysis and Forecast
11.1 Introduction
11.2 North America Fan-Out Wafer Level Packaging Market Size Forecast by Country
11.2.1 U.S.
11.2.2 Canada
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 North America Fan-Out Wafer Level Packaging Market Size Forecast by Type
11.6.1 High Density Fan-Out
11.6.2 Core Fan-Out
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 North America Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
11.10.1 200mm
11.10.2 Panel
11.10.3 300mm
11.11 Basis Point Share (BPS) Analysis by Carrier Type
11.12 Absolute $ Opportunity Assessment by Carrier Type
11.13 Market Attractiveness Analysis by Carrier Type
11.14 North America Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
11.14.1 Automotive
11.14.2 Aerospace & Defense
11.14.3 Industrial
11.14.4 IT & Telecommunication
11.14.5 Consumer Electronics
11.14.6 Healthcare
11.15 Basis Point Share (BPS) Analysis by Industry Vertical
11.16 Absolute $ Opportunity Assessment by Industry Vertical
11.17 Market Attractiveness Analysis by Industry Vertical
11.18 North America Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
11.18.1 IDM
11.18.2 Foundry
11.18.3 OSAT
11.19 Basis Point Share (BPS) Analysis by Business Model
11.20 Absolute $ Opportunity Assessment by Business Model
11.21 Market Attractiveness Analysis by Business Model
Chapter 12 Europe Fan-Out Wafer Level Packaging Analysis and Forecast
12.1 Introduction
12.2 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Country
12.2.1 Germany
12.2.2 France
12.2.3 Italy
12.2.4 U.K.
12.2.5 Spain
12.2.6 Russia
12.2.7 Rest of Europe
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Type
12.6.1 High Density Fan-Out
12.6.2 Core Fan-Out
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
12.10.1 200mm
12.10.2 Panel
12.10.3 300mm
12.11 Basis Point Share (BPS) Analysis by Carrier Type
12.12 Absolute $ Opportunity Assessment by Carrier Type
12.13 Market Attractiveness Analysis by Carrier Type
12.14 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
12.14.1 Automotive
12.14.2 Aerospace & Defense
12.14.3 Industrial
12.14.4 IT & Telecommunication
12.14.5 Consumer Electronics
12.14.6 Healthcare
12.15 Basis Point Share (BPS) Analysis by Industry Vertical
12.16 Absolute $ Opportunity Assessment by Industry Vertical
12.17 Market Attractiveness Analysis by Industry Vertical
12.18 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
12.18.1 IDM
12.18.2 Foundry
12.18.3 OSAT
12.19 Basis Point Share (BPS) Analysis by Business Model
12.20 Absolute $ Opportunity Assessment by Business Model
12.21 Market Attractiveness Analysis by Business Model
Chapter 13 Asia Pacific Fan-Out Wafer Level Packaging Analysis and Forecast
13.1 Introduction
13.2 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Country
13.2.1 China
13.2.2 Japan
13.2.3 South Korea
13.2.4 India
13.2.5 Australia
13.2.6 South East Asia (SEA)
13.2.7 Rest of Asia Pacific (APAC)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Type
13.6.1 High Density Fan-Out
13.6.2 Core Fan-Out
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
13.10.1 200mm
13.10.2 Panel
13.10.3 300mm
13.11 Basis Point Share (BPS) Analysis by Carrier Type
13.12 Absolute $ Opportunity Assessment by Carrier Type
13.13 Market Attractiveness Analysis by Carrier Type
13.14 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
13.14.1 Automotive
13.14.2 Aerospace & Defense
13.14.3 Industrial
13.14.4 IT & Telecommunication
13.14.5 Consumer Electronics
13.14.6 Healthcare
13.15 Basis Point Share (BPS) Analysis by Industry Vertical
13.16 Absolute $ Opportunity Assessment by Industry Vertical
13.17 Market Attractiveness Analysis by Industry Vertical
13.18 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
13.18.1 IDM
13.18.2 Foundry
13.18.3 OSAT
13.19 Basis Point Share (BPS) Analysis by Business Model
13.20 Absolute $ Opportunity Assessment by Business Model
13.21 Market Attractiveness Analysis by Business Model
Chapter 14 Latin America Fan-Out Wafer Level Packaging Analysis and Forecast
14.1 Introduction
14.2 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Country
14.2.1 Brazil
14.2.2 Mexico
14.2.3 Rest of Latin America (LATAM)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Type
14.6.1 High Density Fan-Out
14.6.2 Core Fan-Out
14.7 Basis Point Share (BPS) Analysis by Type
14.8 Absolute $ Opportunity Assessment by Type
14.9 Market Attractiveness Analysis by Type
14.10 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
14.10.1 200mm
14.10.2 Panel
14.10.3 300mm
14.11 Basis Point Share (BPS) Analysis by Carrier Type
14.12 Absolute $ Opportunity Assessment by Carrier Type
14.13 Market Attractiveness Analysis by Carrier Type
14.14 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
14.14.1 Automotive
14.14.2 Aerospace & Defense
14.14.3 Industrial
14.14.4 IT & Telecommunication
14.14.5 Consumer Electronics
14.14.6 Healthcare
14.15 Basis Point Share (BPS) Analysis by Industry Vertical
14.16 Absolute $ Opportunity Assessment by Industry Vertical
14.17 Market Attractiveness Analysis by Industry Vertical
14.18 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
14.18.1 IDM
14.18.2 Foundry
14.18.3 OSAT
14.19 Basis Point Share (BPS) Analysis by Business Model
14.20 Absolute $ Opportunity Assessment by Business Model
14.21 Market Attractiveness Analysis by Business Model
Chapter 15 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Analysis and Forecast
15.1 Introduction
15.2 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Country
15.2.1 Saudi Arabia
15.2.2 South Africa
15.2.3 UAE
15.2.4 Rest of Middle East & Africa (MEA)
15.3 Basis Point Share (BPS) Analysis by Country
15.4 Absolute $ Opportunity Assessment by Country
15.5 Market Attractiveness Analysis by Country
15.6 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Type
15.6.1 High Density Fan-Out
15.6.2 Core Fan-Out
15.7 Basis Point Share (BPS) Analysis by Type
15.8 Absolute $ Opportunity Assessment by Type
15.9 Market Attractiveness Analysis by Type
15.10 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
15.10.1 200mm
15.10.2 Panel
15.10.3 300mm
15.11 Basis Point Share (BPS) Analysis by Carrier Type
15.12 Absolute $ Opportunity Assessment by Carrier Type
15.13 Market Attractiveness Analysis by Carrier Type
15.14 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
15.14.1 Automotive
15.14.2 Aerospace & Defense
15.14.3 Industrial
15.14.4 IT & Telecommunication
15.14.5 Consumer Electronics
15.14.6 Healthcare
15.15 Basis Point Share (BPS) Analysis by Industry Vertical
15.16 Absolute $ Opportunity Assessment by Industry Vertical
15.17 Market Attractiveness Analysis by Industry Vertical
15.18 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
15.18.1 IDM
15.18.2 Foundry
15.18.3 OSAT
15.19 Basis Point Share (BPS) Analysis by Business Model
15.20 Absolute $ Opportunity Assessment by Business Model
15.21 Market Attractiveness Analysis by Business Model
Chapter 16 Competition Landscape
16.1 Fan-Out Wafer Level Packaging Market: Competitive Dashboard
16.2 Global Fan-Out Wafer Level Packaging Market: Market Share Analysis, 2019
16.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
16.3.1 Powertech Technology Inc.
16.3.2 Infineon Technologies AG
16.3.3 Taiwan Semiconductor Manufacturing Company
16.3.4 Amkor Technology
16.3.5 NXP Semiconductors NV
16.3.6 Samsung Electro-Mechanics
16.3.7 STATS ChipPAC
16.3.8 ASE Technology Holding
16.3.9 Renesas Electronics Corp.
16.3.10 Cypress Semiconductor Corp.
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Fan-Out Wafer Level Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Fan-Out Wafer Level Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Fan-Out Wafer Level Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Fan-Out Wafer Level Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Fan-Out Wafer Level Packaging Market Size & Forecast, 2018-2028
4.5.1 Fan-Out Wafer Level Packaging Market Size and Y-o-Y Growth
4.5.2 Fan-Out Wafer Level Packaging Market Absolute $ Opportunity
Chapter 5 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Fan-Out Wafer Level Packaging Market Size Forecast by Type
5.2.1 High Density Fan-Out
5.2.2 Core Fan-Out
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Carrier Type
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Carrier Type
6.1.2 Basis Point Share (BPS) Analysis by Carrier Type
6.1.3 Absolute $ Opportunity Assessment by Carrier Type
6.2 Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
6.2.1 200mm
6.2.2 Panel
6.2.3 300mm
6.3 Market Attractiveness Analysis by Carrier Type
Chapter 7 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Industry Vertical
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
7.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
7.1.3 Absolute $ Opportunity Assessment by Industry Vertical
7.2 Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
7.2.1 Automotive
7.2.2 Aerospace & Defense
7.2.3 Industrial
7.2.4 IT & Telecommunication
7.2.5 Consumer Electronics
7.2.6 Healthcare
7.3 Market Attractiveness Analysis by Industry Vertical
Chapter 8 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Business Model
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Business Model
8.1.2 Basis Point Share (BPS) Analysis by Business Model
8.1.3 Absolute $ Opportunity Assessment by Business Model
8.2 Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
8.2.1 IDM
8.2.2 Foundry
8.2.3 OSAT
8.3 Market Attractiveness Analysis by Business Model
Chapter 9 Global Fan-Out Wafer Level Packaging Market Analysis and Forecast by Region
9.1 Introduction
9.1.1 Key Market Trends & Growth Opportunities by Region
9.1.2 Basis Point Share (BPS) Analysis by Region
9.1.3 Absolute $ Opportunity Assessment by Region
9.2 Fan-Out Wafer Level Packaging Market Size Forecast by Region
9.2.1 North America
9.2.2 Europe
9.2.3 Asia Pacific
9.2.4 Latin America
9.2.5 Middle East & Africa (MEA)
9.3 Market Attractiveness Analysis by Region
Chapter 10 Coronavirus Disease (COVID-19) Impact
10.1 Introduction
10.2 Current & Future Impact Analysis
10.3 Economic Impact Analysis
10.4 Government Policies
10.5 Investment Scenario
Chapter 11 North America Fan-Out Wafer Level Packaging Analysis and Forecast
11.1 Introduction
11.2 North America Fan-Out Wafer Level Packaging Market Size Forecast by Country
11.2.1 U.S.
11.2.2 Canada
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 North America Fan-Out Wafer Level Packaging Market Size Forecast by Type
11.6.1 High Density Fan-Out
11.6.2 Core Fan-Out
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 North America Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
11.10.1 200mm
11.10.2 Panel
11.10.3 300mm
11.11 Basis Point Share (BPS) Analysis by Carrier Type
11.12 Absolute $ Opportunity Assessment by Carrier Type
11.13 Market Attractiveness Analysis by Carrier Type
11.14 North America Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
11.14.1 Automotive
11.14.2 Aerospace & Defense
11.14.3 Industrial
11.14.4 IT & Telecommunication
11.14.5 Consumer Electronics
11.14.6 Healthcare
11.15 Basis Point Share (BPS) Analysis by Industry Vertical
11.16 Absolute $ Opportunity Assessment by Industry Vertical
11.17 Market Attractiveness Analysis by Industry Vertical
11.18 North America Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
11.18.1 IDM
11.18.2 Foundry
11.18.3 OSAT
11.19 Basis Point Share (BPS) Analysis by Business Model
11.20 Absolute $ Opportunity Assessment by Business Model
11.21 Market Attractiveness Analysis by Business Model
Chapter 12 Europe Fan-Out Wafer Level Packaging Analysis and Forecast
12.1 Introduction
12.2 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Country
12.2.1 Germany
12.2.2 France
12.2.3 Italy
12.2.4 U.K.
12.2.5 Spain
12.2.6 Russia
12.2.7 Rest of Europe
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Type
12.6.1 High Density Fan-Out
12.6.2 Core Fan-Out
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
12.10.1 200mm
12.10.2 Panel
12.10.3 300mm
12.11 Basis Point Share (BPS) Analysis by Carrier Type
12.12 Absolute $ Opportunity Assessment by Carrier Type
12.13 Market Attractiveness Analysis by Carrier Type
12.14 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
12.14.1 Automotive
12.14.2 Aerospace & Defense
12.14.3 Industrial
12.14.4 IT & Telecommunication
12.14.5 Consumer Electronics
12.14.6 Healthcare
12.15 Basis Point Share (BPS) Analysis by Industry Vertical
12.16 Absolute $ Opportunity Assessment by Industry Vertical
12.17 Market Attractiveness Analysis by Industry Vertical
12.18 Europe Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
12.18.1 IDM
12.18.2 Foundry
12.18.3 OSAT
12.19 Basis Point Share (BPS) Analysis by Business Model
12.20 Absolute $ Opportunity Assessment by Business Model
12.21 Market Attractiveness Analysis by Business Model
Chapter 13 Asia Pacific Fan-Out Wafer Level Packaging Analysis and Forecast
13.1 Introduction
13.2 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Country
13.2.1 China
13.2.2 Japan
13.2.3 South Korea
13.2.4 India
13.2.5 Australia
13.2.6 South East Asia (SEA)
13.2.7 Rest of Asia Pacific (APAC)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Type
13.6.1 High Density Fan-Out
13.6.2 Core Fan-Out
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
13.10.1 200mm
13.10.2 Panel
13.10.3 300mm
13.11 Basis Point Share (BPS) Analysis by Carrier Type
13.12 Absolute $ Opportunity Assessment by Carrier Type
13.13 Market Attractiveness Analysis by Carrier Type
13.14 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
13.14.1 Automotive
13.14.2 Aerospace & Defense
13.14.3 Industrial
13.14.4 IT & Telecommunication
13.14.5 Consumer Electronics
13.14.6 Healthcare
13.15 Basis Point Share (BPS) Analysis by Industry Vertical
13.16 Absolute $ Opportunity Assessment by Industry Vertical
13.17 Market Attractiveness Analysis by Industry Vertical
13.18 Asia Pacific Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
13.18.1 IDM
13.18.2 Foundry
13.18.3 OSAT
13.19 Basis Point Share (BPS) Analysis by Business Model
13.20 Absolute $ Opportunity Assessment by Business Model
13.21 Market Attractiveness Analysis by Business Model
Chapter 14 Latin America Fan-Out Wafer Level Packaging Analysis and Forecast
14.1 Introduction
14.2 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Country
14.2.1 Brazil
14.2.2 Mexico
14.2.3 Rest of Latin America (LATAM)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Type
14.6.1 High Density Fan-Out
14.6.2 Core Fan-Out
14.7 Basis Point Share (BPS) Analysis by Type
14.8 Absolute $ Opportunity Assessment by Type
14.9 Market Attractiveness Analysis by Type
14.10 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
14.10.1 200mm
14.10.2 Panel
14.10.3 300mm
14.11 Basis Point Share (BPS) Analysis by Carrier Type
14.12 Absolute $ Opportunity Assessment by Carrier Type
14.13 Market Attractiveness Analysis by Carrier Type
14.14 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
14.14.1 Automotive
14.14.2 Aerospace & Defense
14.14.3 Industrial
14.14.4 IT & Telecommunication
14.14.5 Consumer Electronics
14.14.6 Healthcare
14.15 Basis Point Share (BPS) Analysis by Industry Vertical
14.16 Absolute $ Opportunity Assessment by Industry Vertical
14.17 Market Attractiveness Analysis by Industry Vertical
14.18 Latin America Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
14.18.1 IDM
14.18.2 Foundry
14.18.3 OSAT
14.19 Basis Point Share (BPS) Analysis by Business Model
14.20 Absolute $ Opportunity Assessment by Business Model
14.21 Market Attractiveness Analysis by Business Model
Chapter 15 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Analysis and Forecast
15.1 Introduction
15.2 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Country
15.2.1 Saudi Arabia
15.2.2 South Africa
15.2.3 UAE
15.2.4 Rest of Middle East & Africa (MEA)
15.3 Basis Point Share (BPS) Analysis by Country
15.4 Absolute $ Opportunity Assessment by Country
15.5 Market Attractiveness Analysis by Country
15.6 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Type
15.6.1 High Density Fan-Out
15.6.2 Core Fan-Out
15.7 Basis Point Share (BPS) Analysis by Type
15.8 Absolute $ Opportunity Assessment by Type
15.9 Market Attractiveness Analysis by Type
15.10 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Carrier Type
15.10.1 200mm
15.10.2 Panel
15.10.3 300mm
15.11 Basis Point Share (BPS) Analysis by Carrier Type
15.12 Absolute $ Opportunity Assessment by Carrier Type
15.13 Market Attractiveness Analysis by Carrier Type
15.14 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Industry Vertical
15.14.1 Automotive
15.14.2 Aerospace & Defense
15.14.3 Industrial
15.14.4 IT & Telecommunication
15.14.5 Consumer Electronics
15.14.6 Healthcare
15.15 Basis Point Share (BPS) Analysis by Industry Vertical
15.16 Absolute $ Opportunity Assessment by Industry Vertical
15.17 Market Attractiveness Analysis by Industry Vertical
15.18 Middle East & Africa (MEA) Fan-Out Wafer Level Packaging Market Size Forecast by Business Model
15.18.1 IDM
15.18.2 Foundry
15.18.3 OSAT
15.19 Basis Point Share (BPS) Analysis by Business Model
15.20 Absolute $ Opportunity Assessment by Business Model
15.21 Market Attractiveness Analysis by Business Model
Chapter 16 Competition Landscape
16.1 Fan-Out Wafer Level Packaging Market: Competitive Dashboard
16.2 Global Fan-Out Wafer Level Packaging Market: Market Share Analysis, 2019
16.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
16.3.1 Powertech Technology Inc.
16.3.2 Infineon Technologies AG
16.3.3 Taiwan Semiconductor Manufacturing Company
16.3.4 Amkor Technology
16.3.5 NXP Semiconductors NV
16.3.6 Samsung Electro-Mechanics
16.3.7 STATS ChipPAC
16.3.8 ASE Technology Holding
16.3.9 Renesas Electronics Corp.
16.3.10 Cypress Semiconductor Corp.
Segments Covered in the Report
The global Fan-Out Wafer Level Packaging market has been segmented based on
By Type
The global Fan-Out Wafer Level Packaging market has been segmented based on
By Type
- High Density Fan-Out
- Core Fan-Out
- 200mm
- Panel
- 300mm
- Automotive
- Aerospace & Defense
- Industrial
- IT & Telecommunication
- Consumer Electronics
- Healthcare
- IDM
- Foundry
- OSAT
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
- Powertech Technology Inc.
- Infineon Technologies AG
- Taiwan Semiconductor Manufacturing Company
- Amkor Technology
- NXP Semiconductors NV
- Samsung Electro-Mechanics
- STATS ChipPAC
- ASE Technology Holding
- Renesas Electronics Corp.
- Cypress Semiconductor Corp.
Our Clients
Related Reports
Some other reports from this category!
