Global Ball Grid Array (BGA) Packaging Market by Material Type (Tape, Plastic, Ceramic), by Industry Vertical (Automotive, IT & Telecommunication, Aerospace & Defence, Consumer Electronics, Healthcare, Industrial), by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package (Package on Package PoP, Thermally Enhanced BGA, Molded Array Process BGA), by Application (OEM, Aftermarket) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028
Up Market Research published a new report titled “Ball Grid Array (BGA) Packaging Market research report which is segmented by Material Type (Tape, Plastic, Ceramic), by Industry Vertical (Automotive, IT & Telecommunication, Aerospace & Defence, Consumer Electronics, Healthcare, Industrial), by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package (Package on Package PoP, Thermally Enhanced BGA, Molded Array Process BGA), by Application (OEM, Aftermarket), By Players/Companies Infineon Technologies AG, STATS ChipPAC, Amkor Technology, NXP Semiconductors NV., Cypress Semiconductor Corp., Integrated Circuit Engineering Corp., Corintech Ltd., TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology, ASE Technology Holding”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.
Report Scope
| Report Attributes | Report Details |
| Report Title | Ball Grid Array (BGA) Packaging Market Research Report |
| By Material Type | Tape, Plastic, Ceramic |
| By Industry Vertical | Automotive, IT & Telecommunication, Aerospace & Defence, Consumer Electronics, Healthcare, Industrial |
| By Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package | Package on Package PoP, Thermally Enhanced BGA, Molded Array Process BGA |
| By Application | OEM, Aftermarket |
| By Companies | Infineon Technologies AG, STATS ChipPAC, Amkor Technology, NXP Semiconductors NV., Cypress Semiconductor Corp., Integrated Circuit Engineering Corp., Corintech Ltd., TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology, ASE Technology Holding |
| Regions Covered | North America, Europe, APAC, Latin America, MEA |
| Base Year | 2020 |
| Historical Year | 2018 to 2019 (Data from 2010 can be provided as per availability) |
| Forecast Year | 2028 |
| Number of Pages | 232 |
| Number of Tables & Figures | 163 |
| Customization Available | Yes, the report can be customized as per your need. |
The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.
Global Ball Grid Array (BGA) Packaging Market Report Segments:
The market is segmented by Material Type (Tape, Plastic, Ceramic), by Industry Vertical (Automotive, IT & Telecommunication, Aerospace & Defence, Consumer Electronics, Healthcare, Industrial), by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package (Package on Package PoP, Thermally Enhanced BGA, Molded Array Process BGA), by Application (OEM, Aftermarket).
Some of the companies that are profiled in this report are:
- Infineon Technologies AG
- STATS ChipPAC
- Amkor Technology
- NXP Semiconductors NV.
- Cypress Semiconductor Corp.
- Integrated Circuit Engineering Corp.
- Corintech Ltd.
- TriQuint Semiconductor Inc.
- Jiangsu Changjiang Electronics Technology
- ASE Technology Holding
Ball Grid Array (BGA) Packaging Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.
Key Benefits for Industry Participants & Stakeholders:
- Industry drivers, restraints, and opportunities covered in the study
- Neutral perspective on the market performance
- Recent industry trends and developments
- Competitive landscape & strategies of key players
- Potential & niche segments and regions exhibiting promising growth covered
- Historical, current, and projected market size, in terms of value
- In-depth analysis of the Ball Grid Array (BGA) Packaging Market
Overview of the regional outlook of the Ball Grid Array (BGA) Packaging Market:
Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.
Highlights of The Ball Grid Array (BGA) Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of Ball Grid Array (BGA) Packaging Market.
- Historical data and forecast.
- Estimations for the forecast period 2028.
- Developments and trends in the market.
1. Tape
2. Plastic
3. Ceramic
7. By Industry Vertical:1. Automotive
2. IT & Telecommunication
3. Aerospace & Defence
4. Consumer Electronics
5. Healthcare
6. Industrial
8. By Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package:1. Package on Package PoP
2. Thermally Enhanced BGA
3. Molded Array Process BGA
9. By Application:1. OEM
2. Aftermarket
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Ball Grid Array (BGA) Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
Reasons to Purchase the Ball Grid Array (BGA) Packaging Market Report:
- The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
- Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
- Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
- The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
- Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Ball Grid Array (BGA) Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Ball Grid Array (BGA) Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Ball Grid Array (BGA) Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Ball Grid Array (BGA) Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Ball Grid Array (BGA) Packaging Market Size & Forecast, 2018-2028
4.5.1 Ball Grid Array (BGA) Packaging Market Size and Y-o-Y Growth
4.5.2 Ball Grid Array (BGA) Packaging Market Absolute $ Opportunity
Chapter 5 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Material Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Material Type
5.1.2 Basis Point Share (BPS) Analysis by Material Type
5.1.3 Absolute $ Opportunity Assessment by Material Type
5.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
5.2.1 Tape
5.2.2 Plastic
5.2.3 Ceramic
5.3 Market Attractiveness Analysis by Material Type
Chapter 6 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Industry Vertical
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
6.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
6.1.3 Absolute $ Opportunity Assessment by Industry Vertical
6.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
6.2.1 Automotive
6.2.2 IT & Telecommunication
6.2.3 Aerospace & Defence
6.2.4 Consumer Electronics
6.2.5 Healthcare
6.2.6 Industrial
6.3 Market Attractiveness Analysis by Industry Vertical
Chapter 7 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.1.2 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.1.3 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.2.1 Package on Package PoP
7.2.2 Thermally Enhanced BGA
7.2.3 Molded Array Process BGA
7.3 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
Chapter 8 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Application
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Application
8.1.2 Basis Point Share (BPS) Analysis by Application
8.1.3 Absolute $ Opportunity Assessment by Application
8.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Application
8.2.1 OEM
8.2.2 Aftermarket
8.3 Market Attractiveness Analysis by Application
Chapter 9 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Region
9.1 Introduction
9.1.1 Key Market Trends & Growth Opportunities by Region
9.1.2 Basis Point Share (BPS) Analysis by Region
9.1.3 Absolute $ Opportunity Assessment by Region
9.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Region
9.2.1 North America
9.2.2 Europe
9.2.3 Asia Pacific
9.2.4 Latin America
9.2.5 Middle East & Africa (MEA)
9.3 Market Attractiveness Analysis by Region
Chapter 10 Coronavirus Disease (COVID-19) Impact
10.1 Introduction
10.2 Current & Future Impact Analysis
10.3 Economic Impact Analysis
10.4 Government Policies
10.5 Investment Scenario
Chapter 11 North America Ball Grid Array (BGA) Packaging Analysis and Forecast
11.1 Introduction
11.2 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Country
11.2.1 U.S.
11.2.2 Canada
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
11.6.1 Tape
11.6.2 Plastic
11.6.3 Ceramic
11.7 Basis Point Share (BPS) Analysis by Material Type
11.8 Absolute $ Opportunity Assessment by Material Type
11.9 Market Attractiveness Analysis by Material Type
11.10 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
11.10.1 Automotive
11.10.2 IT & Telecommunication
11.10.3 Aerospace & Defence
11.10.4 Consumer Electronics
11.10.5 Healthcare
11.10.6 Industrial
11.11 Basis Point Share (BPS) Analysis by Industry Vertical
11.12 Absolute $ Opportunity Assessment by Industry Vertical
11.13 Market Attractiveness Analysis by Industry Vertical
11.14 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.14.1 Package on Package PoP
11.14.2 Thermally Enhanced BGA
11.14.3 Molded Array Process BGA
11.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.18 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Application
11.18.1 OEM
11.18.2 Aftermarket
11.19 Basis Point Share (BPS) Analysis by Application
11.20 Absolute $ Opportunity Assessment by Application
11.21 Market Attractiveness Analysis by Application
Chapter 12 Europe Ball Grid Array (BGA) Packaging Analysis and Forecast
12.1 Introduction
12.2 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Country
12.2.1 Germany
12.2.2 France
12.2.3 Italy
12.2.4 U.K.
12.2.5 Spain
12.2.6 Russia
12.2.7 Rest of Europe
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
12.6.1 Tape
12.6.2 Plastic
12.6.3 Ceramic
12.7 Basis Point Share (BPS) Analysis by Material Type
12.8 Absolute $ Opportunity Assessment by Material Type
12.9 Market Attractiveness Analysis by Material Type
12.10 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
12.10.1 Automotive
12.10.2 IT & Telecommunication
12.10.3 Aerospace & Defence
12.10.4 Consumer Electronics
12.10.5 Healthcare
12.10.6 Industrial
12.11 Basis Point Share (BPS) Analysis by Industry Vertical
12.12 Absolute $ Opportunity Assessment by Industry Vertical
12.13 Market Attractiveness Analysis by Industry Vertical
12.14 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.14.1 Package on Package PoP
12.14.2 Thermally Enhanced BGA
12.14.3 Molded Array Process BGA
12.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.18 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Application
12.18.1 OEM
12.18.2 Aftermarket
12.19 Basis Point Share (BPS) Analysis by Application
12.20 Absolute $ Opportunity Assessment by Application
12.21 Market Attractiveness Analysis by Application
Chapter 13 Asia Pacific Ball Grid Array (BGA) Packaging Analysis and Forecast
13.1 Introduction
13.2 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Country
13.2.1 China
13.2.2 Japan
13.2.3 South Korea
13.2.4 India
13.2.5 Australia
13.2.6 South East Asia (SEA)
13.2.7 Rest of Asia Pacific (APAC)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
13.6.1 Tape
13.6.2 Plastic
13.6.3 Ceramic
13.7 Basis Point Share (BPS) Analysis by Material Type
13.8 Absolute $ Opportunity Assessment by Material Type
13.9 Market Attractiveness Analysis by Material Type
13.10 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
13.10.1 Automotive
13.10.2 IT & Telecommunication
13.10.3 Aerospace & Defence
13.10.4 Consumer Electronics
13.10.5 Healthcare
13.10.6 Industrial
13.11 Basis Point Share (BPS) Analysis by Industry Vertical
13.12 Absolute $ Opportunity Assessment by Industry Vertical
13.13 Market Attractiveness Analysis by Industry Vertical
13.14 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.14.1 Package on Package PoP
13.14.2 Thermally Enhanced BGA
13.14.3 Molded Array Process BGA
13.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.18 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Application
13.18.1 OEM
13.18.2 Aftermarket
13.19 Basis Point Share (BPS) Analysis by Application
13.20 Absolute $ Opportunity Assessment by Application
13.21 Market Attractiveness Analysis by Application
Chapter 14 Latin America Ball Grid Array (BGA) Packaging Analysis and Forecast
14.1 Introduction
14.2 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Country
14.2.1 Brazil
14.2.2 Mexico
14.2.3 Rest of Latin America (LATAM)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
14.6.1 Tape
14.6.2 Plastic
14.6.3 Ceramic
14.7 Basis Point Share (BPS) Analysis by Material Type
14.8 Absolute $ Opportunity Assessment by Material Type
14.9 Market Attractiveness Analysis by Material Type
14.10 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
14.10.1 Automotive
14.10.2 IT & Telecommunication
14.10.3 Aerospace & Defence
14.10.4 Consumer Electronics
14.10.5 Healthcare
14.10.6 Industrial
14.11 Basis Point Share (BPS) Analysis by Industry Vertical
14.12 Absolute $ Opportunity Assessment by Industry Vertical
14.13 Market Attractiveness Analysis by Industry Vertical
14.14 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.14.1 Package on Package PoP
14.14.2 Thermally Enhanced BGA
14.14.3 Molded Array Process BGA
14.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.18 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Application
14.18.1 OEM
14.18.2 Aftermarket
14.19 Basis Point Share (BPS) Analysis by Application
14.20 Absolute $ Opportunity Assessment by Application
14.21 Market Attractiveness Analysis by Application
Chapter 15 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Analysis and Forecast
15.1 Introduction
15.2 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Country
15.2.1 Saudi Arabia
15.2.2 South Africa
15.2.3 UAE
15.2.4 Rest of Middle East & Africa (MEA)
15.3 Basis Point Share (BPS) Analysis by Country
15.4 Absolute $ Opportunity Assessment by Country
15.5 Market Attractiveness Analysis by Country
15.6 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
15.6.1 Tape
15.6.2 Plastic
15.6.3 Ceramic
15.7 Basis Point Share (BPS) Analysis by Material Type
15.8 Absolute $ Opportunity Assessment by Material Type
15.9 Market Attractiveness Analysis by Material Type
15.10 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
15.10.1 Automotive
15.10.2 IT & Telecommunication
15.10.3 Aerospace & Defence
15.10.4 Consumer Electronics
15.10.5 Healthcare
15.10.6 Industrial
15.11 Basis Point Share (BPS) Analysis by Industry Vertical
15.12 Absolute $ Opportunity Assessment by Industry Vertical
15.13 Market Attractiveness Analysis by Industry Vertical
15.14 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.14.1 Package on Package PoP
15.14.2 Thermally Enhanced BGA
15.14.3 Molded Array Process BGA
15.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.18 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Application
15.18.1 OEM
15.18.2 Aftermarket
15.19 Basis Point Share (BPS) Analysis by Application
15.20 Absolute $ Opportunity Assessment by Application
15.21 Market Attractiveness Analysis by Application
Chapter 16 Competition Landscape
16.1 Ball Grid Array (BGA) Packaging Market: Competitive Dashboard
16.2 Global Ball Grid Array (BGA) Packaging Market: Market Share Analysis, 2019
16.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
16.3.1 Infineon Technologies AG
16.3.2 STATS ChipPAC
16.3.3 Amkor Technology
16.3.4 NXP Semiconductors NV.
16.3.5 Cypress Semiconductor Corp.
16.3.6 Integrated Circuit Engineering Corp.
16.3.7 Corintech Ltd.
16.3.8 TriQuint Semiconductor Inc.
16.3.9 Jiangsu Changjiang Electronics Technology
16.3.10 ASE Technology Holding
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Ball Grid Array (BGA) Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Ball Grid Array (BGA) Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Ball Grid Array (BGA) Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Ball Grid Array (BGA) Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Ball Grid Array (BGA) Packaging Market Size & Forecast, 2018-2028
4.5.1 Ball Grid Array (BGA) Packaging Market Size and Y-o-Y Growth
4.5.2 Ball Grid Array (BGA) Packaging Market Absolute $ Opportunity
Chapter 5 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Material Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Material Type
5.1.2 Basis Point Share (BPS) Analysis by Material Type
5.1.3 Absolute $ Opportunity Assessment by Material Type
5.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
5.2.1 Tape
5.2.2 Plastic
5.2.3 Ceramic
5.3 Market Attractiveness Analysis by Material Type
Chapter 6 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Industry Vertical
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
6.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
6.1.3 Absolute $ Opportunity Assessment by Industry Vertical
6.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
6.2.1 Automotive
6.2.2 IT & Telecommunication
6.2.3 Aerospace & Defence
6.2.4 Consumer Electronics
6.2.5 Healthcare
6.2.6 Industrial
6.3 Market Attractiveness Analysis by Industry Vertical
Chapter 7 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.1.2 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.1.3 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
7.2.1 Package on Package PoP
7.2.2 Thermally Enhanced BGA
7.2.3 Molded Array Process BGA
7.3 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
Chapter 8 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Application
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Application
8.1.2 Basis Point Share (BPS) Analysis by Application
8.1.3 Absolute $ Opportunity Assessment by Application
8.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Application
8.2.1 OEM
8.2.2 Aftermarket
8.3 Market Attractiveness Analysis by Application
Chapter 9 Global Ball Grid Array (BGA) Packaging Market Analysis and Forecast by Region
9.1 Introduction
9.1.1 Key Market Trends & Growth Opportunities by Region
9.1.2 Basis Point Share (BPS) Analysis by Region
9.1.3 Absolute $ Opportunity Assessment by Region
9.2 Ball Grid Array (BGA) Packaging Market Size Forecast by Region
9.2.1 North America
9.2.2 Europe
9.2.3 Asia Pacific
9.2.4 Latin America
9.2.5 Middle East & Africa (MEA)
9.3 Market Attractiveness Analysis by Region
Chapter 10 Coronavirus Disease (COVID-19) Impact
10.1 Introduction
10.2 Current & Future Impact Analysis
10.3 Economic Impact Analysis
10.4 Government Policies
10.5 Investment Scenario
Chapter 11 North America Ball Grid Array (BGA) Packaging Analysis and Forecast
11.1 Introduction
11.2 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Country
11.2.1 U.S.
11.2.2 Canada
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
11.6.1 Tape
11.6.2 Plastic
11.6.3 Ceramic
11.7 Basis Point Share (BPS) Analysis by Material Type
11.8 Absolute $ Opportunity Assessment by Material Type
11.9 Market Attractiveness Analysis by Material Type
11.10 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
11.10.1 Automotive
11.10.2 IT & Telecommunication
11.10.3 Aerospace & Defence
11.10.4 Consumer Electronics
11.10.5 Healthcare
11.10.6 Industrial
11.11 Basis Point Share (BPS) Analysis by Industry Vertical
11.12 Absolute $ Opportunity Assessment by Industry Vertical
11.13 Market Attractiveness Analysis by Industry Vertical
11.14 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.14.1 Package on Package PoP
11.14.2 Thermally Enhanced BGA
11.14.3 Molded Array Process BGA
11.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
11.18 North America Ball Grid Array (BGA) Packaging Market Size Forecast by Application
11.18.1 OEM
11.18.2 Aftermarket
11.19 Basis Point Share (BPS) Analysis by Application
11.20 Absolute $ Opportunity Assessment by Application
11.21 Market Attractiveness Analysis by Application
Chapter 12 Europe Ball Grid Array (BGA) Packaging Analysis and Forecast
12.1 Introduction
12.2 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Country
12.2.1 Germany
12.2.2 France
12.2.3 Italy
12.2.4 U.K.
12.2.5 Spain
12.2.6 Russia
12.2.7 Rest of Europe
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
12.6.1 Tape
12.6.2 Plastic
12.6.3 Ceramic
12.7 Basis Point Share (BPS) Analysis by Material Type
12.8 Absolute $ Opportunity Assessment by Material Type
12.9 Market Attractiveness Analysis by Material Type
12.10 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
12.10.1 Automotive
12.10.2 IT & Telecommunication
12.10.3 Aerospace & Defence
12.10.4 Consumer Electronics
12.10.5 Healthcare
12.10.6 Industrial
12.11 Basis Point Share (BPS) Analysis by Industry Vertical
12.12 Absolute $ Opportunity Assessment by Industry Vertical
12.13 Market Attractiveness Analysis by Industry Vertical
12.14 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.14.1 Package on Package PoP
12.14.2 Thermally Enhanced BGA
12.14.3 Molded Array Process BGA
12.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
12.18 Europe Ball Grid Array (BGA) Packaging Market Size Forecast by Application
12.18.1 OEM
12.18.2 Aftermarket
12.19 Basis Point Share (BPS) Analysis by Application
12.20 Absolute $ Opportunity Assessment by Application
12.21 Market Attractiveness Analysis by Application
Chapter 13 Asia Pacific Ball Grid Array (BGA) Packaging Analysis and Forecast
13.1 Introduction
13.2 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Country
13.2.1 China
13.2.2 Japan
13.2.3 South Korea
13.2.4 India
13.2.5 Australia
13.2.6 South East Asia (SEA)
13.2.7 Rest of Asia Pacific (APAC)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
13.6.1 Tape
13.6.2 Plastic
13.6.3 Ceramic
13.7 Basis Point Share (BPS) Analysis by Material Type
13.8 Absolute $ Opportunity Assessment by Material Type
13.9 Market Attractiveness Analysis by Material Type
13.10 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
13.10.1 Automotive
13.10.2 IT & Telecommunication
13.10.3 Aerospace & Defence
13.10.4 Consumer Electronics
13.10.5 Healthcare
13.10.6 Industrial
13.11 Basis Point Share (BPS) Analysis by Industry Vertical
13.12 Absolute $ Opportunity Assessment by Industry Vertical
13.13 Market Attractiveness Analysis by Industry Vertical
13.14 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.14.1 Package on Package PoP
13.14.2 Thermally Enhanced BGA
13.14.3 Molded Array Process BGA
13.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
13.18 Asia Pacific Ball Grid Array (BGA) Packaging Market Size Forecast by Application
13.18.1 OEM
13.18.2 Aftermarket
13.19 Basis Point Share (BPS) Analysis by Application
13.20 Absolute $ Opportunity Assessment by Application
13.21 Market Attractiveness Analysis by Application
Chapter 14 Latin America Ball Grid Array (BGA) Packaging Analysis and Forecast
14.1 Introduction
14.2 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Country
14.2.1 Brazil
14.2.2 Mexico
14.2.3 Rest of Latin America (LATAM)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
14.6.1 Tape
14.6.2 Plastic
14.6.3 Ceramic
14.7 Basis Point Share (BPS) Analysis by Material Type
14.8 Absolute $ Opportunity Assessment by Material Type
14.9 Market Attractiveness Analysis by Material Type
14.10 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
14.10.1 Automotive
14.10.2 IT & Telecommunication
14.10.3 Aerospace & Defence
14.10.4 Consumer Electronics
14.10.5 Healthcare
14.10.6 Industrial
14.11 Basis Point Share (BPS) Analysis by Industry Vertical
14.12 Absolute $ Opportunity Assessment by Industry Vertical
14.13 Market Attractiveness Analysis by Industry Vertical
14.14 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.14.1 Package on Package PoP
14.14.2 Thermally Enhanced BGA
14.14.3 Molded Array Process BGA
14.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
14.18 Latin America Ball Grid Array (BGA) Packaging Market Size Forecast by Application
14.18.1 OEM
14.18.2 Aftermarket
14.19 Basis Point Share (BPS) Analysis by Application
14.20 Absolute $ Opportunity Assessment by Application
14.21 Market Attractiveness Analysis by Application
Chapter 15 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Analysis and Forecast
15.1 Introduction
15.2 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Country
15.2.1 Saudi Arabia
15.2.2 South Africa
15.2.3 UAE
15.2.4 Rest of Middle East & Africa (MEA)
15.3 Basis Point Share (BPS) Analysis by Country
15.4 Absolute $ Opportunity Assessment by Country
15.5 Market Attractiveness Analysis by Country
15.6 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Material Type
15.6.1 Tape
15.6.2 Plastic
15.6.3 Ceramic
15.7 Basis Point Share (BPS) Analysis by Material Type
15.8 Absolute $ Opportunity Assessment by Material Type
15.9 Market Attractiveness Analysis by Material Type
15.10 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Industry Vertical
15.10.1 Automotive
15.10.2 IT & Telecommunication
15.10.3 Aerospace & Defence
15.10.4 Consumer Electronics
15.10.5 Healthcare
15.10.6 Industrial
15.11 Basis Point Share (BPS) Analysis by Industry Vertical
15.12 Absolute $ Opportunity Assessment by Industry Vertical
15.13 Market Attractiveness Analysis by Industry Vertical
15.14 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.14.1 Package on Package PoP
15.14.2 Thermally Enhanced BGA
15.14.3 Molded Array Process BGA
15.15 Basis Point Share (BPS) Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.16 Absolute $ Opportunity Assessment by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.17 Market Attractiveness Analysis by Type (Molded Array Process BGAThermally Enhanced BGAPackage on Package
15.18 Middle East & Africa (MEA) Ball Grid Array (BGA) Packaging Market Size Forecast by Application
15.18.1 OEM
15.18.2 Aftermarket
15.19 Basis Point Share (BPS) Analysis by Application
15.20 Absolute $ Opportunity Assessment by Application
15.21 Market Attractiveness Analysis by Application
Chapter 16 Competition Landscape
16.1 Ball Grid Array (BGA) Packaging Market: Competitive Dashboard
16.2 Global Ball Grid Array (BGA) Packaging Market: Market Share Analysis, 2019
16.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
16.3.1 Infineon Technologies AG
16.3.2 STATS ChipPAC
16.3.3 Amkor Technology
16.3.4 NXP Semiconductors NV.
16.3.5 Cypress Semiconductor Corp.
16.3.6 Integrated Circuit Engineering Corp.
16.3.7 Corintech Ltd.
16.3.8 TriQuint Semiconductor Inc.
16.3.9 Jiangsu Changjiang Electronics Technology
16.3.10 ASE Technology Holding
Segments Covered in the Report
The global Ball Grid Array (BGA) Packaging market has been segmented based on
By Material Type
The global Ball Grid Array (BGA) Packaging market has been segmented based on
By Material Type
- Tape
- Plastic
- Ceramic
- Automotive
- IT & Telecommunication
- Aerospace & Defence
- Consumer Electronics
- Healthcare
- Industrial
- Package on Package PoP
- Thermally Enhanced BGA
- Molded Array Process BGA
- OEM
- Aftermarket
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
- Infineon Technologies AG
- STATS ChipPAC
- Amkor Technology
- NXP Semiconductors NV.
- Cypress Semiconductor Corp.
- Integrated Circuit Engineering Corp.
- Corintech Ltd.
- TriQuint Semiconductor Inc.
- Jiangsu Changjiang Electronics Technology
- ASE Technology Holding
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