The global plasma etching systems market is projected to grow at a CAGR of 7.6% by 2028. The total market size in terms of revenue was estimated to be $2.48 billion in 2018 and is expected to reach $4.51 billion by 2028 with the same growth rate during the forecast period from 2019-2028.
Plasma etching systems are used in the manufacturing of semiconductor chips, electronic products, and medical devices. It is an effective process to create a controlled etched pattern on hard materials like silicon wafer for semiconductors or glass substrate for optical lenses by using plasma as an ion source. The major driving factor of the global market growth can be attributed to rising demand from industries such as the electronics & microelectronics sector and the healthcare industry due to increasing technological advancements in these sectors globally. Moreover, introducing new equipment with advanced features is expected to boost revenue over the coming years.
On the basis of type, the global plasma etching systems market is segmented into inductively coupled plasma (ICP), reactive ion etching (RIE), and deep reactive ion etching (DRIE).
Inductively coupled plasma (ICP) is a process of etching material that uses an electric field to create charged particles. This technology can be used for deep reactive ion etching processes. It is a type of plasma etching method that utilizes an RF generator to create a high-frequency electromagnetic field. The HFE supplies power for generating ionized gas and accelerates ions in order to remove material from patterned surfaces, patterns, or materials with low melting points such as polymers.
Moreover, it is often used for microelectronics device fabrication process development because ICP provides higher resolution than other methods and can be performed at lower temperatures which makes this technique more environmentally friendly than others. Additionally, inductively coupled plasma (ICP) can also be applied in the semiconductor industry, medical industry, and electronics & microelectronics.
Reactive ion etching (RIE) is a process that removes material from the surface of an object by bombarding it with ions. The method involves three steps: An electric field pulls positive and negative charged particles to their respective electrodes, creating what's known as an electrical double layer between them; the device discharges these ions toward the workpiece, which creates plasma that reacts with the substrate at high temperature and pressure while removing or altering its surface structure; finally, gas flows across the workpiece to remove debris created by this process.
The RIE system includes different devices such as reactor-type systems generating higher power densities than in other processes like inductively coupled plasma (ICP), electron cyclotron resonance (ECR), and microwave plasma for etching.
Deep reactive ion etching (DRIE) is a process that uses an electric field to generate ions and plasma on the surface of silicon wafers, which can then be etched away. A DRIE machine consists of two sets of rails, one set for transporting the wafer from station to station and another set for supplying power to the upper rail in order to create a chemical reaction across its surface. As with other methods mentioned above, gas flows over the workpiece at high pressure as it undergoes this process. DRIE and ICP are the other types of different methods available in this market. The DRIE form involves low-pressure argon gas, while ICP is done under vacuum.
On the basis of application, the global plasma etching systems market is segmented into the semiconductor industry, medical industry, electronics & microelectronics sector, and others.
The semiconductor industry is one of the major applications for plasma etching systems. These are used in processes like chemical-mechanical polishing, wet oxidation, and dry oxide processing (CMP). It is the largest in terms of revenue as it contributes to more than 50% share of the market. The application includes etching or cleaning, which are used for a variety of purposes such as removing contaminants and residues from electronic devices. This section also provides facilities to remove excess material while depositing thin films on PCBs (Printed Circuit Boards) with micron-level precision. The semiconductor industry mainly focuses on three-parameter: dimensional accuracy, surface finish quality, and processing time efficiency. Etching has been widely adopted by this sector due to its capability to accomplish these parameters quickly at a lower cost resulting in higher profit margins for manufacturers.
Plasma etching systems for the medical industry can be used in the procedure of dentistry, such as drilling out the decay and filling cavities. It is also being applied in a number of surgical procedures like joint replacements.
A plasma etching system is used in the electronics and microelectronics industry for producing semiconductor chips. Plasma etching systems are also utilized to produce printed circuit boards, solar cells, and other electronic components such as antennas.
On the basis of region, the global plasma etching systems market is segmented into North America, Europe, Asia Pacific, and the Rest of the World. The North American region is expected to account for the largest market share in 2018 and is projected to retain its dominance over the forecast period.
The growth of the global plasma etching systems market is primarily driven by increasing demand for semiconductors, which in turn will increase the consumption of these products. The production and consumption of microelectronics are on a steep rise due to the growing need for miniaturization. Hence, there is an increased usage rate for these machines that can deal with minute components such as resist patterns or IC lines. Moreover, electronics & semiconductor companies have invested more funds into R&D activities in order to develop better technologies such as new materials coupled with high-powered lasers and other types of machinery used during manufacturing processes; this has led to higher expenditures among industry players thus leading to a significant jump in revenue generation across the globe. In addition, rising demand for medical applications is expected to boost the market size of plasma etching systems.
Up Market Research published a new report titled “Plasma Etching Systems Market research report which is segmented by Types (Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others), By Applications (Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others), By Players/Companies Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO Inc., Applied Materials, Inc., Sentech, SPTS Technologies (an Orbotech Company), GigaLane, CORIAL, Trion Technology, NAURA, Plasma Etch, Inc., Tokyo Electron Limited”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.
|Report Attributes||Report Details|
|Report Title||Plasma Etching Systems Market Research Report|
|By Type||Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others|
|By Application||Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others|
|By Companies||Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO Inc., Applied Materials, Inc., Sentech, SPTS Technologies (an Orbotech Company), GigaLane, CORIAL, Trion Technology, NAURA, Plasma Etch, Inc., Tokyo Electron Limited|
|Regions Covered||North America, Europe, APAC, Latin America, MEA|
|Historical Year||2018 to 2019 (Data from 2010 can be provided as per availability)|
|Number of Pages||247|
|Number of Tables & Figures||173|
|Customization Available||Yes, the report can be customized as per your need.|
The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.
The market is segmented by Type Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others and By Application Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others.
Some of the companies that are profiled in this report are:
Plasma Etching Systems Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.
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Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.
We have studied the Plasma Etching Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.
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