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Global Plasma Etching Systems Market by Type (Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others), By Application (Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028

  • Report ID: ME-639
  • Author: Up Market Research
  • Rating: 4.9
  • Total Reviews: 99
  • No. Of Pages: 247
  • Format:
  • Pub. Date: 2021-03-01
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The global plasma etching systems market is projected to grow at a CAGR of 7.6% by 2028. The total market size in terms of revenue was estimated to be $2.48 billion in 2018 and is expected to reach $4.51 billion by 2028 with the same growth rate during the forecast period from 2019-2028.

Plasma etching systems are used in the manufacturing of semiconductor chips, electronic products, and medical devices. It is an effective process to create a controlled etched pattern on hard materials like silicon wafer for semiconductors or glass substrate for optical lenses by using plasma as an ion source. The major driving factor of the global market growth can be attributed to rising demand from industries such as the electronics & microelectronics sector and the healthcare industry due to increasing technological advancements in these sectors globally. Moreover, introducing new equipment with advanced features is expected to boost revenue over the coming years.

On the basis of type, the global plasma etching systems market is segmented into inductively coupled plasma (ICP), reactive ion etching (RIE), and deep reactive ion etching (DRIE).

Inductively Coupled Plasma (ICP)

Inductively coupled plasma (ICP) is a process of etching material that uses an electric field to create charged particles. This technology can be used for deep reactive ion etching processes. It is a type of plasma etching method that utilizes an RF generator to create a high-frequency electromagnetic field. The HFE supplies power for generating ionized gas and accelerates ions in order to remove material from patterned surfaces, patterns, or materials with low melting points such as polymers.

Moreover, it is often used for microelectronics device fabrication process development because ICP provides higher resolution than other methods and can be performed at lower temperatures which makes this technique more environmentally friendly than others. Additionally, inductively coupled plasma (ICP) can also be applied in the semiconductor industry, medical industry, and electronics & microelectronics.

Reactive Ion Etching (RIE)

Reactive ion etching (RIE) is a process that removes material from the surface of an object by bombarding it with ions. The method involves three steps: An electric field pulls positive and negative charged particles to their respective electrodes, creating what's known as an electrical double layer between them; the device discharges these ions toward the workpiece, which creates plasma that reacts with the substrate at high temperature and pressure while removing or altering its surface structure; finally, gas flows across the workpiece to remove debris created by this process.

The RIE system includes different devices such as reactor-type systems generating higher power densities than in other processes like inductively coupled plasma (ICP), electron cyclotron resonance (ECR), and microwave plasma for etching.

Deep Reactive Ion Etching (DRIE)

Deep reactive ion etching (DRIE) is a process that uses an electric field to generate ions and plasma on the surface of silicon wafers, which can then be etched away. A DRIE machine consists of two sets of rails, one set for transporting the wafer from station to station and another set for supplying power to the upper rail in order to create a chemical reaction across its surface. As with other methods mentioned above, gas flows over the workpiece at high pressure as it undergoes this process. DRIE and ICP are the other types of different methods available in this market. The DRIE form involves low-pressure argon gas, while ICP is done under vacuum.

On the basis of application, the global plasma etching systems market is segmented into the semiconductor industry, medical industry, electronics & microelectronics sector, and others.

Semiconductor Industry

The semiconductor industry is one of the major applications for plasma etching systems. These are used in processes like chemical-mechanical polishing, wet oxidation, and dry oxide processing (CMP). It is the largest in terms of revenue as it contributes to more than 50% share of the market. The application includes etching or cleaning, which are used for a variety of purposes such as removing contaminants and residues from electronic devices. This section also provides facilities to remove excess material while depositing thin films on PCBs (Printed Circuit Boards) with micron-level precision. The semiconductor industry mainly focuses on three-parameter: dimensional accuracy, surface finish quality, and processing time efficiency. Etching has been widely adopted by this sector due to its capability to accomplish these parameters quickly at a lower cost resulting in higher profit margins for manufacturers.

Medical Industry

Plasma etching systems for the medical industry can be used in the procedure of dentistry, such as drilling out the decay and filling cavities. It is also being applied in a number of surgical procedures like joint replacements.

Microelectronics Sector

A plasma etching system is used in the electronics and microelectronics industry for producing semiconductor chips. Plasma etching systems are also utilized to produce printed circuit boards, solar cells, and other electronic components such as antennas.

On the basis of region, the global plasma etching systems market is segmented into North America, Europe, Asia Pacific, and the Rest of the World. The North American region is expected to account for the largest market share in 2018 and is projected to retain its dominance over the forecast period.

Growth Factors

The growth of the global plasma etching systems market is primarily driven by increasing demand for semiconductors, which in turn will increase the consumption of these products. The production and consumption of microelectronics are on a steep rise due to the growing need for miniaturization. Hence, there is an increased usage rate for these machines that can deal with minute components such as resist patterns or IC lines. Moreover, electronics & semiconductor companies have invested more funds into R&D activities in order to develop better technologies such as new materials coupled with high-powered lasers and other types of machinery used during manufacturing processes; this has led to higher expenditures among industry players thus leading to a significant jump in revenue generation across the globe. In addition, rising demand for medical applications is expected to boost the market size of plasma etching systems.


Up Market Research published a new report titled “Plasma Etching Systems Market research report which is segmented by Types (Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others), By Applications (Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others), By Players/Companies Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO Inc., Applied Materials, Inc., Sentech, SPTS Technologies (an Orbotech Company), GigaLane, CORIAL, Trion Technology, NAURA, Plasma Etch, Inc., Tokyo Electron Limited”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.

 

Report Scope

Report Attributes Report Details
Report Title Plasma Etching Systems Market Research Report
By Type Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others
By Application Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others
By Companies Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO Inc., Applied Materials, Inc., Sentech, SPTS Technologies (an Orbotech Company), GigaLane, CORIAL, Trion Technology, NAURA, Plasma Etch, Inc., Tokyo Electron Limited
Regions Covered North America, Europe, APAC, Latin America, MEA
Base Year 2020
Historical Year 2018 to 2019 (Data from 2010 can be provided as per availability)
Forecast Year 2028
Number of Pages 247
Number of Tables & Figures 173
Customization Available Yes, the report can be customized as per your need.
 

The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.


Global Plasma Etching Systems Industry Outlook
 

Global Plasma Etching Systems Market Report Segments:

The market is segmented by Type Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others and By Application Semiconductor Industry, Medical Industry, Electronics & Microelectronics, Others.

 

Some of the companies that are profiled in this report are:

  1. Oxford Instruments
  2. ULVAC
  3. Lam Research
  4. AMEC
  5. PlasmaTherm
  6. SAMCO Inc.
  7. Applied Materials, Inc.
  8. Sentech
  9. SPTS Technologies (an Orbotech Company)
  10. GigaLane
  11. CORIAL
  12. Trion Technology
  13. NAURA
  14. Plasma Etch, Inc.
  15. Tokyo Electron Limited
 

Plasma Etching Systems Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.

 

Key Benefits for Industry Participants & Stakeholders:

  • Industry drivers, restraints, and opportunities covered in the study
  • Neutral perspective on the market performance
  • Recent industry trends and developments
  • Competitive landscape & strategies of key players
  • Potential & niche segments and regions exhibiting promising growth covered
  • Historical, current, and projected market size, in terms of value
  • In-depth analysis of the Plasma Etching Systems Market
 

Overview of the regional outlook of the Plasma Etching Systems Market:

Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.


Plasma Etching Systems Market Overview
 

Highlights of The Plasma Etching Systems Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of Plasma Etching Systems Market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2028.
  5. Developments and trends in the market.
  6. By Type:

                1. Inductively Coupled Plasma (ICP)

                2. Reactive Ion Etching (RIE)

                3. Deep Reactive Ion Etching (DRIE)

                4. Others

       7. By Application:

                1. Semiconductor Industry

                2. Medical Industry

                3. Electronics & Microelectronics

                4. Others

  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.
 

We have studied the Plasma Etching Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.

 

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Plasma Etching Systems Market Statistics
 

Reasons to Purchase the Plasma Etching Systems Market Report:

  • The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
  • Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
  • Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
  • The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
  • Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Plasma Etching Systems Market Overview
   4.1 Introduction 
      4.1.1 Market Taxonomy 
      4.1.2 Market Definition 
      4.1.3 Macro-Economic Factors Impacting the Market Growth 
   4.2 Plasma Etching Systems Market Dynamics 
      4.2.1 Market Drivers 
      4.2.2 Market Restraints 
      4.2.3 Market Opportunity 
   4.3 Plasma Etching Systems Market - Supply Chain Analysis 
      4.3.1 List of Key Suppliers 
      4.3.2 List of Key Distributors 
      4.3.3 List of Key Consumers 
   4.4 Key Forces Shaping the Plasma Etching Systems Market 
      4.4.1 Bargaining Power of Suppliers 
      4.4.2 Bargaining Power of Buyers 
      4.4.3 Threat of Substitution 
      4.4.4 Threat of New Entrants 
      4.4.5 Competitive Rivalry 
   4.5 Global Plasma Etching Systems Market Size & Forecast, 2018-2028 
      4.5.1 Plasma Etching Systems Market Size and Y-o-Y Growth 
      4.5.2 Plasma Etching Systems Market Absolute $ Opportunity 


Chapter 5 Global Plasma Etching Systems Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2 Plasma Etching Systems Market Size Forecast by Type
      5.2.1 Inductively Coupled Plasma (ICP)
      5.2.2 Reactive Ion Etching (RIE)
      5.2.3 Deep Reactive Ion Etching (DRIE)
      5.2.4 Others
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global Plasma Etching Systems Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2 Plasma Etching Systems Market Size Forecast by Applications
      6.2.1 Semiconductor Industry
      6.2.2 Medical Industry
      6.2.3 Electronics & Microelectronics
      6.2.4 Others
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Plasma Etching Systems Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Plasma Etching Systems Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America Plasma Etching Systems Analysis and Forecast
   9.1 Introduction
   9.2 North America Plasma Etching Systems Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America Plasma Etching Systems Market Size Forecast by Type
      9.6.1 Inductively Coupled Plasma (ICP)
      9.6.2 Reactive Ion Etching (RIE)
      9.6.3 Deep Reactive Ion Etching (DRIE)
      9.6.4 Others
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America Plasma Etching Systems Market Size Forecast by Applications
      9.10.1 Semiconductor Industry
      9.10.2 Medical Industry
      9.10.3 Electronics & Microelectronics
      9.10.4 Others
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe Plasma Etching Systems Analysis and Forecast
   10.1 Introduction
   10.2 Europe Plasma Etching Systems Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe Plasma Etching Systems Market Size Forecast by Type
      10.6.1 Inductively Coupled Plasma (ICP)
      10.6.2 Reactive Ion Etching (RIE)
      10.6.3 Deep Reactive Ion Etching (DRIE)
      10.6.4 Others
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe Plasma Etching Systems Market Size Forecast by Applications
      10.10.1 Semiconductor Industry
      10.10.2 Medical Industry
      10.10.3 Electronics & Microelectronics
      10.10.4 Others
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific Plasma Etching Systems Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific Plasma Etching Systems Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific Plasma Etching Systems Market Size Forecast by Type
      11.6.1 Inductively Coupled Plasma (ICP)
      11.6.2 Reactive Ion Etching (RIE)
      11.6.3 Deep Reactive Ion Etching (DRIE)
      11.6.4 Others
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific Plasma Etching Systems Market Size Forecast by Applications
      11.10.1 Semiconductor Industry
      11.10.2 Medical Industry
      11.10.3 Electronics & Microelectronics
      11.10.4 Others
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America Plasma Etching Systems Analysis and Forecast
   12.1 Introduction
   12.2 Latin America Plasma Etching Systems Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America Plasma Etching Systems Market Size Forecast by Type
      12.6.1 Inductively Coupled Plasma (ICP)
      12.6.2 Reactive Ion Etching (RIE)
      12.6.3 Deep Reactive Ion Etching (DRIE)
      12.6.4 Others
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America Plasma Etching Systems Market Size Forecast by Applications
      12.10.1 Semiconductor Industry
      12.10.2 Medical Industry
      12.10.3 Electronics & Microelectronics
      12.10.4 Others
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA) Plasma Etching Systems Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA) Plasma Etching Systems Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA) Plasma Etching Systems Market Size Forecast by Type
      13.6.1 Inductively Coupled Plasma (ICP)
      13.6.2 Reactive Ion Etching (RIE)
      13.6.3 Deep Reactive Ion Etching (DRIE)
      13.6.4 Others
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA) Plasma Etching Systems Market Size Forecast by Applications
      13.10.1 Semiconductor Industry
      13.10.2 Medical Industry
      13.10.3 Electronics & Microelectronics
      13.10.4 Others
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Plasma Etching Systems Market: Competitive Dashboard
   14.2 Global Plasma Etching Systems Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Oxford Instruments
      14.3.2 ULVAC
      14.3.3 Lam Research
      14.3.4 AMEC
      14.3.5 PlasmaTherm
      14.3.6 SAMCO Inc.
      14.3.7 Applied Materials, Inc.
      14.3.8 Sentech
      14.3.9 SPTS Technologies (an Orbotech Company)
      14.3.10 GigaLane
      14.3.11 CORIAL
      14.3.12 Trion Technology
      14.3.13 NAURA
      14.3.14 Plasma Etch, Inc.
      14.3.15 Tokyo Electron Limited
Segments Covered in the Report
The global Plasma Etching Systems market has been segmented based on

By Types
  • Inductively Coupled Plasma (ICP)
  • Reactive Ion Etching (RIE)
  • Deep Reactive Ion Etching (DRIE)
  • Others
By Applications
  • Semiconductor Industry
  • Medical Industry
  • Electronics & Microelectronics
  • Others
Regions
  • Asia Pacific
  • North America
  • Latin America
  • Europe
  • Middle East & Africa
Key Players
  • Oxford Instruments
  • ULVAC
  • Lam Research
  • AMEC
  • PlasmaTherm
  • SAMCO Inc.
  • Applied Materials, Inc.
  • Sentech
  • SPTS Technologies (an Orbotech Company)
  • GigaLane
  • CORIAL
  • Trion Technology
  • NAURA
  • Plasma Etch, Inc.
  • Tokyo Electron Limited

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