Global 3D IC and 2.5D IC Market by Packaging Type (3D Wafer-Level Chip-Scale Packaging, 2.5D, 3D TSV), by Industry Vertical (Smart Technologies, Medical Devices, Aerospace, Telecommunication, Industry Sector, Military, Consumer Electronics, Automotive), by Organizational Size (Large Enterprises, Small & Medium Enterprises) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028
Up Market Research published a new report titled “3D IC and 2.5D IC Market research report which is segmented by Packaging Type (3D Wafer-Level Chip-Scale Packaging, 2.5D, 3D TSV), by Industry Vertical (Smart Technologies, Medical Devices, Aerospace, Telecommunication, Industry Sector, Military, Consumer Electronics, Automotive), by Organizational Size (Large Enterprises, Small & Medium Enterprises), By Players/Companies Amkor Technology, ASE Group, Toshiba Corp., Jiangsu Changjiang Electronics Technology Co. Ltd., Broadcom Ltd., United Microelectronics Corp., Intel Corp., Taiwan Semiconductor Manufacturing Company Limited, Stmicroelectronics NV, Samsung Electronics Co. Ltd.”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.
Report Scope
| Report Attributes | Report Details |
| Report Title | 3D IC and 2.5D IC Market Research Report |
| By Packaging Type | 3D Wafer-Level Chip-Scale Packaging, 2.5D, 3D TSV |
| By Industry Vertical | Smart Technologies, Medical Devices, Aerospace, Telecommunication, Industry Sector, Military, Consumer Electronics, Automotive |
| By Organizational Size | Large Enterprises, Small & Medium Enterprises |
| By Companies | Amkor Technology, ASE Group, Toshiba Corp., Jiangsu Changjiang Electronics Technology Co. Ltd., Broadcom Ltd., United Microelectronics Corp., Intel Corp., Taiwan Semiconductor Manufacturing Company Limited, Stmicroelectronics NV, Samsung Electronics Co. Ltd. |
| Regions Covered | North America, Europe, APAC, Latin America, MEA |
| Base Year | 2020 |
| Historical Year | 2018 to 2019 (Data from 2010 can be provided as per availability) |
| Forecast Year | 2028 |
| Number of Pages | 226 |
| Number of Tables & Figures | 159 |
| Customization Available | Yes, the report can be customized as per your need. |
The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.
Global 3D IC and 2.5D IC Market Report Segments:
The market is segmented by Packaging Type (3D Wafer-Level Chip-Scale Packaging, 2.5D, 3D TSV), by Industry Vertical (Smart Technologies, Medical Devices, Aerospace, Telecommunication, Industry Sector, Military, Consumer Electronics, Automotive), by Organizational Size (Large Enterprises, Small & Medium Enterprises).
Some of the companies that are profiled in this report are:
- Amkor Technology
- ASE Group
- Toshiba Corp.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Broadcom Ltd.
- United Microelectronics Corp.
- Intel Corp.
- Taiwan Semiconductor Manufacturing Company Limited
- Stmicroelectronics NV
- Samsung Electronics Co. Ltd.
3D IC and 2.5D IC Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.
Key Benefits for Industry Participants & Stakeholders:
- Industry drivers, restraints, and opportunities covered in the study
- Neutral perspective on the market performance
- Recent industry trends and developments
- Competitive landscape & strategies of key players
- Potential & niche segments and regions exhibiting promising growth covered
- Historical, current, and projected market size, in terms of value
- In-depth analysis of the 3D IC and 2.5D IC Market
Overview of the regional outlook of the 3D IC and 2.5D IC Market:
Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.
Highlights of The 3D IC and 2.5D IC Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of 3D IC and 2.5D IC Market.
- Historical data and forecast.
- Estimations for the forecast period 2028.
- Developments and trends in the market.
1. 3D Wafer-Level Chip-Scale Packaging
2. 2.5D
3. 3D TSV
7. By Industry Vertical:1. Smart Technologies
2. Medical Devices
3. Aerospace
4. Telecommunication
5. Industry Sector
6. Military
7. Consumer Electronics
8. Automotive
8. By Organizational Size:1. Large Enterprises
2. Small & Medium Enterprises
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 3D IC and 2.5D IC Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
Reasons to Purchase the 3D IC and 2.5D IC Market Report:
- The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
- Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
- Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
- The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
- Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 3D IC and 2.5D IC Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 3D IC and 2.5D IC Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 3D IC and 2.5D IC Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 3D IC and 2.5D IC Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 3D IC and 2.5D IC Market Size & Forecast, 2018-2028
4.5.1 3D IC and 2.5D IC Market Size and Y-o-Y Growth
4.5.2 3D IC and 2.5D IC Market Absolute $ Opportunity
Chapter 5 Global 3D IC and 2.5D IC Market Analysis and Forecast by Packaging Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Packaging Type
5.1.2 Basis Point Share (BPS) Analysis by Packaging Type
5.1.3 Absolute $ Opportunity Assessment by Packaging Type
5.2 3D IC and 2.5D IC Market Size Forecast by Packaging Type
5.2.1 3D Wafer-Level Chip-Scale Packaging
5.2.2 2.5D
5.2.3 3D TSV
5.3 Market Attractiveness Analysis by Packaging Type
Chapter 6 Global 3D IC and 2.5D IC Market Analysis and Forecast by Industry Vertical
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
6.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
6.1.3 Absolute $ Opportunity Assessment by Industry Vertical
6.2 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
6.2.1 Smart Technologies
6.2.2 Medical Devices
6.2.3 Aerospace
6.2.4 Telecommunication
6.2.5 Industry Sector
6.2.6 Military
6.2.7 Consumer Electronics
6.2.8 Automotive
6.3 Market Attractiveness Analysis by Industry Vertical
Chapter 7 Global 3D IC and 2.5D IC Market Analysis and Forecast by Organizational Size
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Organizational Size
7.1.2 Basis Point Share (BPS) Analysis by Organizational Size
7.1.3 Absolute $ Opportunity Assessment by Organizational Size
7.2 3D IC and 2.5D IC Market Size Forecast by Organizational Size
7.2.1 Large Enterprises
7.2.2 Small & Medium Enterprises
7.3 Market Attractiveness Analysis by Organizational Size
Chapter 8 Global 3D IC and 2.5D IC Market Analysis and Forecast by Region
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Region
8.1.2 Basis Point Share (BPS) Analysis by Region
8.1.3 Absolute $ Opportunity Assessment by Region
8.2 3D IC and 2.5D IC Market Size Forecast by Region
8.2.1 North America
8.2.2 Europe
8.2.3 Asia Pacific
8.2.4 Latin America
8.2.5 Middle East & Africa (MEA)
8.3 Market Attractiveness Analysis by Region
Chapter 9 Coronavirus Disease (COVID-19) Impact
9.1 Introduction
9.2 Current & Future Impact Analysis
9.3 Economic Impact Analysis
9.4 Government Policies
9.5 Investment Scenario
Chapter 10 North America 3D IC and 2.5D IC Analysis and Forecast
10.1 Introduction
10.2 North America 3D IC and 2.5D IC Market Size Forecast by Country
10.2.1 U.S.
10.2.2 Canada
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 North America 3D IC and 2.5D IC Market Size Forecast by Packaging Type
10.6.1 3D Wafer-Level Chip-Scale Packaging
10.6.2 2.5D
10.6.3 3D TSV
10.7 Basis Point Share (BPS) Analysis by Packaging Type
10.8 Absolute $ Opportunity Assessment by Packaging Type
10.9 Market Attractiveness Analysis by Packaging Type
10.10 North America 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
10.10.1 Smart Technologies
10.10.2 Medical Devices
10.10.3 Aerospace
10.10.4 Telecommunication
10.10.5 Industry Sector
10.10.6 Military
10.10.7 Consumer Electronics
10.10.8 Automotive
10.11 Basis Point Share (BPS) Analysis by Industry Vertical
10.12 Absolute $ Opportunity Assessment by Industry Vertical
10.13 Market Attractiveness Analysis by Industry Vertical
10.14 North America 3D IC and 2.5D IC Market Size Forecast by Organizational Size
10.14.1 Large Enterprises
10.14.2 Small & Medium Enterprises
10.15 Basis Point Share (BPS) Analysis by Organizational Size
10.16 Absolute $ Opportunity Assessment by Organizational Size
10.17 Market Attractiveness Analysis by Organizational Size
Chapter 11 Europe 3D IC and 2.5D IC Analysis and Forecast
11.1 Introduction
11.2 Europe 3D IC and 2.5D IC Market Size Forecast by Country
11.2.1 Germany
11.2.2 France
11.2.3 Italy
11.2.4 U.K.
11.2.5 Spain
11.2.6 Russia
11.2.7 Rest of Europe
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Europe 3D IC and 2.5D IC Market Size Forecast by Packaging Type
11.6.1 3D Wafer-Level Chip-Scale Packaging
11.6.2 2.5D
11.6.3 3D TSV
11.7 Basis Point Share (BPS) Analysis by Packaging Type
11.8 Absolute $ Opportunity Assessment by Packaging Type
11.9 Market Attractiveness Analysis by Packaging Type
11.10 Europe 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
11.10.1 Smart Technologies
11.10.2 Medical Devices
11.10.3 Aerospace
11.10.4 Telecommunication
11.10.5 Industry Sector
11.10.6 Military
11.10.7 Consumer Electronics
11.10.8 Automotive
11.11 Basis Point Share (BPS) Analysis by Industry Vertical
11.12 Absolute $ Opportunity Assessment by Industry Vertical
11.13 Market Attractiveness Analysis by Industry Vertical
11.14 Europe 3D IC and 2.5D IC Market Size Forecast by Organizational Size
11.14.1 Large Enterprises
11.14.2 Small & Medium Enterprises
11.15 Basis Point Share (BPS) Analysis by Organizational Size
11.16 Absolute $ Opportunity Assessment by Organizational Size
11.17 Market Attractiveness Analysis by Organizational Size
Chapter 12 Asia Pacific 3D IC and 2.5D IC Analysis and Forecast
12.1 Introduction
12.2 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Country
12.2.1 China
12.2.2 Japan
12.2.3 South Korea
12.2.4 India
12.2.5 Australia
12.2.6 South East Asia (SEA)
12.2.7 Rest of Asia Pacific (APAC)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Packaging Type
12.6.1 3D Wafer-Level Chip-Scale Packaging
12.6.2 2.5D
12.6.3 3D TSV
12.7 Basis Point Share (BPS) Analysis by Packaging Type
12.8 Absolute $ Opportunity Assessment by Packaging Type
12.9 Market Attractiveness Analysis by Packaging Type
12.10 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
12.10.1 Smart Technologies
12.10.2 Medical Devices
12.10.3 Aerospace
12.10.4 Telecommunication
12.10.5 Industry Sector
12.10.6 Military
12.10.7 Consumer Electronics
12.10.8 Automotive
12.11 Basis Point Share (BPS) Analysis by Industry Vertical
12.12 Absolute $ Opportunity Assessment by Industry Vertical
12.13 Market Attractiveness Analysis by Industry Vertical
12.14 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Organizational Size
12.14.1 Large Enterprises
12.14.2 Small & Medium Enterprises
12.15 Basis Point Share (BPS) Analysis by Organizational Size
12.16 Absolute $ Opportunity Assessment by Organizational Size
12.17 Market Attractiveness Analysis by Organizational Size
Chapter 13 Latin America 3D IC and 2.5D IC Analysis and Forecast
13.1 Introduction
13.2 Latin America 3D IC and 2.5D IC Market Size Forecast by Country
13.2.1 Brazil
13.2.2 Mexico
13.2.3 Rest of Latin America (LATAM)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Latin America 3D IC and 2.5D IC Market Size Forecast by Packaging Type
13.6.1 3D Wafer-Level Chip-Scale Packaging
13.6.2 2.5D
13.6.3 3D TSV
13.7 Basis Point Share (BPS) Analysis by Packaging Type
13.8 Absolute $ Opportunity Assessment by Packaging Type
13.9 Market Attractiveness Analysis by Packaging Type
13.10 Latin America 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
13.10.1 Smart Technologies
13.10.2 Medical Devices
13.10.3 Aerospace
13.10.4 Telecommunication
13.10.5 Industry Sector
13.10.6 Military
13.10.7 Consumer Electronics
13.10.8 Automotive
13.11 Basis Point Share (BPS) Analysis by Industry Vertical
13.12 Absolute $ Opportunity Assessment by Industry Vertical
13.13 Market Attractiveness Analysis by Industry Vertical
13.14 Latin America 3D IC and 2.5D IC Market Size Forecast by Organizational Size
13.14.1 Large Enterprises
13.14.2 Small & Medium Enterprises
13.15 Basis Point Share (BPS) Analysis by Organizational Size
13.16 Absolute $ Opportunity Assessment by Organizational Size
13.17 Market Attractiveness Analysis by Organizational Size
Chapter 14 Middle East & Africa (MEA) 3D IC and 2.5D IC Analysis and Forecast
14.1 Introduction
14.2 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Country
14.2.1 Saudi Arabia
14.2.2 South Africa
14.2.3 UAE
14.2.4 Rest of Middle East & Africa (MEA)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Packaging Type
14.6.1 3D Wafer-Level Chip-Scale Packaging
14.6.2 2.5D
14.6.3 3D TSV
14.7 Basis Point Share (BPS) Analysis by Packaging Type
14.8 Absolute $ Opportunity Assessment by Packaging Type
14.9 Market Attractiveness Analysis by Packaging Type
14.10 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
14.10.1 Smart Technologies
14.10.2 Medical Devices
14.10.3 Aerospace
14.10.4 Telecommunication
14.10.5 Industry Sector
14.10.6 Military
14.10.7 Consumer Electronics
14.10.8 Automotive
14.11 Basis Point Share (BPS) Analysis by Industry Vertical
14.12 Absolute $ Opportunity Assessment by Industry Vertical
14.13 Market Attractiveness Analysis by Industry Vertical
14.14 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Organizational Size
14.14.1 Large Enterprises
14.14.2 Small & Medium Enterprises
14.15 Basis Point Share (BPS) Analysis by Organizational Size
14.16 Absolute $ Opportunity Assessment by Organizational Size
14.17 Market Attractiveness Analysis by Organizational Size
Chapter 15 Competition Landscape
15.1 3D IC and 2.5D IC Market: Competitive Dashboard
15.2 Global 3D IC and 2.5D IC Market: Market Share Analysis, 2019
15.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
15.3.1 Amkor Technology
15.3.2 ASE Group
15.3.3 Toshiba Corp.
15.3.4 Jiangsu Changjiang Electronics Technology Co. Ltd.
15.3.5 Broadcom Ltd.
15.3.6 United Microelectronics Corp.
15.3.7 Intel Corp.
15.3.8 Taiwan Semiconductor Manufacturing Company Limited
15.3.9 Stmicroelectronics NV
15.3.10 Samsung Electronics Co. Ltd.
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 3D IC and 2.5D IC Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 3D IC and 2.5D IC Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 3D IC and 2.5D IC Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 3D IC and 2.5D IC Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 3D IC and 2.5D IC Market Size & Forecast, 2018-2028
4.5.1 3D IC and 2.5D IC Market Size and Y-o-Y Growth
4.5.2 3D IC and 2.5D IC Market Absolute $ Opportunity
Chapter 5 Global 3D IC and 2.5D IC Market Analysis and Forecast by Packaging Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Packaging Type
5.1.2 Basis Point Share (BPS) Analysis by Packaging Type
5.1.3 Absolute $ Opportunity Assessment by Packaging Type
5.2 3D IC and 2.5D IC Market Size Forecast by Packaging Type
5.2.1 3D Wafer-Level Chip-Scale Packaging
5.2.2 2.5D
5.2.3 3D TSV
5.3 Market Attractiveness Analysis by Packaging Type
Chapter 6 Global 3D IC and 2.5D IC Market Analysis and Forecast by Industry Vertical
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
6.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
6.1.3 Absolute $ Opportunity Assessment by Industry Vertical
6.2 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
6.2.1 Smart Technologies
6.2.2 Medical Devices
6.2.3 Aerospace
6.2.4 Telecommunication
6.2.5 Industry Sector
6.2.6 Military
6.2.7 Consumer Electronics
6.2.8 Automotive
6.3 Market Attractiveness Analysis by Industry Vertical
Chapter 7 Global 3D IC and 2.5D IC Market Analysis and Forecast by Organizational Size
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Organizational Size
7.1.2 Basis Point Share (BPS) Analysis by Organizational Size
7.1.3 Absolute $ Opportunity Assessment by Organizational Size
7.2 3D IC and 2.5D IC Market Size Forecast by Organizational Size
7.2.1 Large Enterprises
7.2.2 Small & Medium Enterprises
7.3 Market Attractiveness Analysis by Organizational Size
Chapter 8 Global 3D IC and 2.5D IC Market Analysis and Forecast by Region
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Region
8.1.2 Basis Point Share (BPS) Analysis by Region
8.1.3 Absolute $ Opportunity Assessment by Region
8.2 3D IC and 2.5D IC Market Size Forecast by Region
8.2.1 North America
8.2.2 Europe
8.2.3 Asia Pacific
8.2.4 Latin America
8.2.5 Middle East & Africa (MEA)
8.3 Market Attractiveness Analysis by Region
Chapter 9 Coronavirus Disease (COVID-19) Impact
9.1 Introduction
9.2 Current & Future Impact Analysis
9.3 Economic Impact Analysis
9.4 Government Policies
9.5 Investment Scenario
Chapter 10 North America 3D IC and 2.5D IC Analysis and Forecast
10.1 Introduction
10.2 North America 3D IC and 2.5D IC Market Size Forecast by Country
10.2.1 U.S.
10.2.2 Canada
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 North America 3D IC and 2.5D IC Market Size Forecast by Packaging Type
10.6.1 3D Wafer-Level Chip-Scale Packaging
10.6.2 2.5D
10.6.3 3D TSV
10.7 Basis Point Share (BPS) Analysis by Packaging Type
10.8 Absolute $ Opportunity Assessment by Packaging Type
10.9 Market Attractiveness Analysis by Packaging Type
10.10 North America 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
10.10.1 Smart Technologies
10.10.2 Medical Devices
10.10.3 Aerospace
10.10.4 Telecommunication
10.10.5 Industry Sector
10.10.6 Military
10.10.7 Consumer Electronics
10.10.8 Automotive
10.11 Basis Point Share (BPS) Analysis by Industry Vertical
10.12 Absolute $ Opportunity Assessment by Industry Vertical
10.13 Market Attractiveness Analysis by Industry Vertical
10.14 North America 3D IC and 2.5D IC Market Size Forecast by Organizational Size
10.14.1 Large Enterprises
10.14.2 Small & Medium Enterprises
10.15 Basis Point Share (BPS) Analysis by Organizational Size
10.16 Absolute $ Opportunity Assessment by Organizational Size
10.17 Market Attractiveness Analysis by Organizational Size
Chapter 11 Europe 3D IC and 2.5D IC Analysis and Forecast
11.1 Introduction
11.2 Europe 3D IC and 2.5D IC Market Size Forecast by Country
11.2.1 Germany
11.2.2 France
11.2.3 Italy
11.2.4 U.K.
11.2.5 Spain
11.2.6 Russia
11.2.7 Rest of Europe
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Europe 3D IC and 2.5D IC Market Size Forecast by Packaging Type
11.6.1 3D Wafer-Level Chip-Scale Packaging
11.6.2 2.5D
11.6.3 3D TSV
11.7 Basis Point Share (BPS) Analysis by Packaging Type
11.8 Absolute $ Opportunity Assessment by Packaging Type
11.9 Market Attractiveness Analysis by Packaging Type
11.10 Europe 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
11.10.1 Smart Technologies
11.10.2 Medical Devices
11.10.3 Aerospace
11.10.4 Telecommunication
11.10.5 Industry Sector
11.10.6 Military
11.10.7 Consumer Electronics
11.10.8 Automotive
11.11 Basis Point Share (BPS) Analysis by Industry Vertical
11.12 Absolute $ Opportunity Assessment by Industry Vertical
11.13 Market Attractiveness Analysis by Industry Vertical
11.14 Europe 3D IC and 2.5D IC Market Size Forecast by Organizational Size
11.14.1 Large Enterprises
11.14.2 Small & Medium Enterprises
11.15 Basis Point Share (BPS) Analysis by Organizational Size
11.16 Absolute $ Opportunity Assessment by Organizational Size
11.17 Market Attractiveness Analysis by Organizational Size
Chapter 12 Asia Pacific 3D IC and 2.5D IC Analysis and Forecast
12.1 Introduction
12.2 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Country
12.2.1 China
12.2.2 Japan
12.2.3 South Korea
12.2.4 India
12.2.5 Australia
12.2.6 South East Asia (SEA)
12.2.7 Rest of Asia Pacific (APAC)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Packaging Type
12.6.1 3D Wafer-Level Chip-Scale Packaging
12.6.2 2.5D
12.6.3 3D TSV
12.7 Basis Point Share (BPS) Analysis by Packaging Type
12.8 Absolute $ Opportunity Assessment by Packaging Type
12.9 Market Attractiveness Analysis by Packaging Type
12.10 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
12.10.1 Smart Technologies
12.10.2 Medical Devices
12.10.3 Aerospace
12.10.4 Telecommunication
12.10.5 Industry Sector
12.10.6 Military
12.10.7 Consumer Electronics
12.10.8 Automotive
12.11 Basis Point Share (BPS) Analysis by Industry Vertical
12.12 Absolute $ Opportunity Assessment by Industry Vertical
12.13 Market Attractiveness Analysis by Industry Vertical
12.14 Asia Pacific 3D IC and 2.5D IC Market Size Forecast by Organizational Size
12.14.1 Large Enterprises
12.14.2 Small & Medium Enterprises
12.15 Basis Point Share (BPS) Analysis by Organizational Size
12.16 Absolute $ Opportunity Assessment by Organizational Size
12.17 Market Attractiveness Analysis by Organizational Size
Chapter 13 Latin America 3D IC and 2.5D IC Analysis and Forecast
13.1 Introduction
13.2 Latin America 3D IC and 2.5D IC Market Size Forecast by Country
13.2.1 Brazil
13.2.2 Mexico
13.2.3 Rest of Latin America (LATAM)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Latin America 3D IC and 2.5D IC Market Size Forecast by Packaging Type
13.6.1 3D Wafer-Level Chip-Scale Packaging
13.6.2 2.5D
13.6.3 3D TSV
13.7 Basis Point Share (BPS) Analysis by Packaging Type
13.8 Absolute $ Opportunity Assessment by Packaging Type
13.9 Market Attractiveness Analysis by Packaging Type
13.10 Latin America 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
13.10.1 Smart Technologies
13.10.2 Medical Devices
13.10.3 Aerospace
13.10.4 Telecommunication
13.10.5 Industry Sector
13.10.6 Military
13.10.7 Consumer Electronics
13.10.8 Automotive
13.11 Basis Point Share (BPS) Analysis by Industry Vertical
13.12 Absolute $ Opportunity Assessment by Industry Vertical
13.13 Market Attractiveness Analysis by Industry Vertical
13.14 Latin America 3D IC and 2.5D IC Market Size Forecast by Organizational Size
13.14.1 Large Enterprises
13.14.2 Small & Medium Enterprises
13.15 Basis Point Share (BPS) Analysis by Organizational Size
13.16 Absolute $ Opportunity Assessment by Organizational Size
13.17 Market Attractiveness Analysis by Organizational Size
Chapter 14 Middle East & Africa (MEA) 3D IC and 2.5D IC Analysis and Forecast
14.1 Introduction
14.2 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Country
14.2.1 Saudi Arabia
14.2.2 South Africa
14.2.3 UAE
14.2.4 Rest of Middle East & Africa (MEA)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Packaging Type
14.6.1 3D Wafer-Level Chip-Scale Packaging
14.6.2 2.5D
14.6.3 3D TSV
14.7 Basis Point Share (BPS) Analysis by Packaging Type
14.8 Absolute $ Opportunity Assessment by Packaging Type
14.9 Market Attractiveness Analysis by Packaging Type
14.10 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Industry Vertical
14.10.1 Smart Technologies
14.10.2 Medical Devices
14.10.3 Aerospace
14.10.4 Telecommunication
14.10.5 Industry Sector
14.10.6 Military
14.10.7 Consumer Electronics
14.10.8 Automotive
14.11 Basis Point Share (BPS) Analysis by Industry Vertical
14.12 Absolute $ Opportunity Assessment by Industry Vertical
14.13 Market Attractiveness Analysis by Industry Vertical
14.14 Middle East & Africa (MEA) 3D IC and 2.5D IC Market Size Forecast by Organizational Size
14.14.1 Large Enterprises
14.14.2 Small & Medium Enterprises
14.15 Basis Point Share (BPS) Analysis by Organizational Size
14.16 Absolute $ Opportunity Assessment by Organizational Size
14.17 Market Attractiveness Analysis by Organizational Size
Chapter 15 Competition Landscape
15.1 3D IC and 2.5D IC Market: Competitive Dashboard
15.2 Global 3D IC and 2.5D IC Market: Market Share Analysis, 2019
15.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
15.3.1 Amkor Technology
15.3.2 ASE Group
15.3.3 Toshiba Corp.
15.3.4 Jiangsu Changjiang Electronics Technology Co. Ltd.
15.3.5 Broadcom Ltd.
15.3.6 United Microelectronics Corp.
15.3.7 Intel Corp.
15.3.8 Taiwan Semiconductor Manufacturing Company Limited
15.3.9 Stmicroelectronics NV
15.3.10 Samsung Electronics Co. Ltd.
Segments Covered in the Report
The global 3D IC and 2.5D IC market has been segmented based on
By Packaging Type
The global 3D IC and 2.5D IC market has been segmented based on
By Packaging Type
- 3D Wafer-Level Chip-Scale Packaging
- 2.5D
- 3D TSV
- Smart Technologies
- Medical Devices
- Aerospace
- Telecommunication
- Industry Sector
- Military
- Consumer Electronics
- Automotive
- Large Enterprises
- Small & Medium Enterprises
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
- Amkor Technology
- ASE Group
- Toshiba Corp.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Broadcom Ltd.
- United Microelectronics Corp.
- Intel Corp.
- Taiwan Semiconductor Manufacturing Company Limited
- Stmicroelectronics NV
- Samsung Electronics Co. Ltd.
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