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Global Electronics Bonding Wire Market by Type (Gold Bonding Wire, Copper Bonding Wire, Silver Bonding Wire, Palladium Coated Copper Bonding Wire, Others), By Application (IC, Transistor, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028

  • Report ID: ES-35710
  • Author: Up Market Research
  • Rating: 5.0
  • Total Reviews: 50
  • No. Of Pages: 232
  • Format:
  • Pub. Date: 2021-04-04
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The Global Electronics bonding Wire Market Size is projected to grow at a CAGR of 6.4% from 2021 to 2028 and reach USD 4.89 billion by the end of the forecast period. The demand for electronic products has increased in developing economies due to their rising disposable income coupled with changing lifestyle trends.

 

Electronics Bonding Wire is a metal wire used in the production of electronics components. It provides electrical connections between two or more electronic devices, mainly ICs and Transistors. The bonding wires are usually coated with an adhesive material that melts during soldering to form strong bonds with other metals such as copper, gold, silver, palladium, etc., depending on their composition.

 

On the basis of Types, the market is segmented into Gold Bonding Wire, Copper Bonding Wire, Silver Bonding Wire, and Palladium Coated Copper Bonding Wire.

 

Gold Bonding Wire:

The gold bonding wire is made up of pure gold as a conductor. It is used in electronic circuits and semiconductors, where the cost-efficiency properties outweigh those of other metals. When compared to copper, gold has superior conductivity (and therefore less resistance), which reduces power loss over long distances; it also resists oxidation at higher temperatures better than most other metal wires do. Gold's malleability gives it excellent electrical contact with circuit boards or chip connections because its surface can be flattened without deforming the wire itself. However this same property makes it more difficult for technicians to cut and crimp connectors onto the end, so solder should always be used when attaching them manually.

 

Copper Bonding Wire:

The copper bonding wire is a type of copper wire that has been used in the manufacturing industry to create joints and bonds between electronic components. The usage of this material is expected to be driven by its reasonably lower cost (due to heavy demand for it), compared with other metal wires such as gold, silver, or palladium coated copper. The copper bonding wire is a low-cost option for manufacturing electronic components. These wires are typically used to connect two or more circuit boards together, and they can be found in all types of electronics devices such as TVs, printers, computers, and servers. Each connector on the copper wire has either one or two holes that form an electrical connection between circuits inside the device. 

 

Silver Bonding Wire:

Silver Bonding Wire is a copper wire that has silver plating. Silver bonding wires are commonly used for chip-to-chip connections and high-frequency, analog circuits inside the IC package. Silver bonders have good resistance to oxidation at room temperature but do not provide as much mechanical strength as gold or palladium when heated to higher temperatures. For this reason, they are usually joined with solder (copper) during manufacturing processes such as wave soldering. A process where molten metal flows over the top of an electronic component in order to attach it to another surface without using heat-sensitive adhesive materials on either side. This prevents any thermal damage caused by elevated temperatures from damaging nearby components while also reducing costs due to less material used.

 

Palladium Coated Copper Bonding Wire:

The palladium-coated copper bonding wire is a type of metal that has been chemically treated in order to make it more durable and corrosion-resistant. This improves the durability of the wiring, which in turn makes them less prone to breaking down or short-circuiting from oxidation damage. In addition, this also offers protection against heat stressors as well as resistivity changes seen with other types of metals like gold or silver due to temperature fluctuations. Palladium-coated wires are typically used when extra protection is needed for circuits because they offer better electrical conductiveness when compared to uncoated copper wires.

 

On the basis of Application, the market is segmented into ICs, Transistors, and Others.

 

ICs:

The electronics bonding wire is an important component in ICs, providing a reliable and cost-effective means of connecting all the integrated circuit (IC) components. Ensuring a proper connection between the various parts leads to good electrical coupling as well as being resistant to environmental conditions such as moisture or temperature fluctuations. It also provides mechanical stability while ensuring reliability for long periods of time.

 

Transistor:

Electronics bonding wires are used in transistors. They primarily provide electrical contact to the semiconductor materials on an insulating substrate (usually silicon) during the fabrication of a transistor. The metal wire is often thermocompressed by heating it with gas at high pressure, which causes its diameter and length to shrink so that it can be inserted into tight spaces between other components or applied directly onto thin films such as oxide layers.

 

On the basis of Region, the market is segmented into North America, Latin America, Europe, Asia Pacific, and the Middle East & Africa. North America is the largest and fastest-growing market for Electronics Bonding Wire.

 

Growth Factors For The Global Electronics Bonding Wire Market:

The growth factors for this market include increasing demand from end-use industries as well as electric vehicles, growing investments in research & development, and innovation activities by leading players such as Shinko Wire Company (Japan) which has developed new manufacturing technologies where lower amounts of palladium can be used with copper or other metals without compromising on performance, etc. Other growth factors are increasing demand for energy-efficient electronic materials and increasing number of manufacturing facilities. Growing demand for low-cost and low-energy consuming devices in emerging economies of the Asia Pacific and Latin America are leading the market growth. Increasing demand from the automotive industry owing to the rising number of electric cars sold worldwide is also boosting the market. 

 


Up Market Research published a new report titled “Electronics Bonding Wire Market research report which is segmented by Types (Gold Bonding Wire, Copper Bonding Wire, Silver Bonding Wire, Palladium Coated Copper Bonding Wire, Others), By Applications (IC, Transistor, Others), By Players/Companies Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant, Custom Chip Connections, Yantai YesNo Electronic Materials”.

 

Report Scope

Report Attributes Report Details
Report Title Electronics Bonding Wire Market Research Report
By Type Gold Bonding Wire, Copper Bonding Wire, Silver Bonding Wire, Palladium Coated Copper Bonding Wire, Others
By Application IC, Transistor, Others
By Companies Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant, Custom Chip Connections, Yantai YesNo Electronic Materials
Regions Covered North America, Europe, APAC, Latin America, MEA
Base Year 2020
Historical Year 2018 to 2019 (Data from 2010 can be provided as per availability)
Forecast Year 2028
Number of Pages 232
Number of Tables & Figures 163
Customization Available Yes, the report can be customized as per your need.
 

The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.


Global Electronics Bonding Wire Industry Outlook
 

Global Electronics Bonding Wire Market Report Segments:

The market is segmented by Type Gold Bonding Wire, Copper Bonding Wire, Silver Bonding Wire, Palladium Coated Copper Bonding Wire, Others and By Application IC, Transistor, Others.

 

Some of the companies that are profiled in this report are:

  1. Heraeus
  2. Tanaka
  3. Sumitomo Metal Mining
  4. MK Electron
  5. AMETEK
  6. Doublink Solders
  7. Yantai Zhaojin Kanfort
  8. Tatsuta Electric Wire & Cable
  9. Kangqiang Electronics
  10. The Prince & Izant
  11. Custom Chip Connections
  12. Yantai YesNo Electronic Materials
 

Electronics Bonding Wire Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.

 

Key Benefits for Industry Participants & Stakeholders:

  • Industry drivers, restraints, and opportunities covered in the study
  • Neutral perspective on the market performance
  • Recent industry trends and developments
  • Competitive landscape & strategies of key players
  • Potential & niche segments and regions exhibiting promising growth covered
  • Historical, current, and projected market size, in terms of value
  • In-depth analysis of the Electronics Bonding Wire Market
 

Overview of the regional outlook of the Electronics Bonding Wire Market:

Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.


Electronics Bonding Wire Market Overview
 

Highlights of The Electronics Bonding Wire Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of Electronics Bonding Wire Market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2028.
  5. Developments and trends in the market.
  6. By Type:

                1. Gold Bonding Wire

                2. Copper Bonding Wire

                3. Silver Bonding Wire

                4. Palladium Coated Copper Bonding Wire

                5. Others

       7. By Application:

                1. IC

                2. Transistor

                3. Others

  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.
 

We have studied the Electronics Bonding Wire Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.

 

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Electronics Bonding Wire Market Statistics
 

Reasons to Purchase the Electronics Bonding Wire Market Report:

  • The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
  • Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
  • Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
  • The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
  • Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronics Bonding Wire Market Overview
   4.1 Introduction 
      4.1.1 Market Taxonomy 
      4.1.2 Market Definition 
      4.1.3 Macro-Economic Factors Impacting the Market Growth 
   4.2 Electronics Bonding Wire Market Dynamics 
      4.2.1 Market Drivers 
      4.2.2 Market Restraints 
      4.2.3 Market Opportunity 
   4.3 Electronics Bonding Wire Market - Supply Chain Analysis 
      4.3.1 List of Key Suppliers 
      4.3.2 List of Key Distributors 
      4.3.3 List of Key Consumers 
   4.4 Key Forces Shaping the Electronics Bonding Wire Market 
      4.4.1 Bargaining Power of Suppliers 
      4.4.2 Bargaining Power of Buyers 
      4.4.3 Threat of Substitution 
      4.4.4 Threat of New Entrants 
      4.4.5 Competitive Rivalry 
   4.5 Global Electronics Bonding Wire Market Size & Forecast, 2018-2028 
      4.5.1 Electronics Bonding Wire Market Size and Y-o-Y Growth 
      4.5.2 Electronics Bonding Wire Market Absolute $ Opportunity 


Chapter 5 Global Electronics Bonding Wire Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2 Electronics Bonding Wire Market Size Forecast by Type
      5.2.1 Gold Bonding Wire
      5.2.2 Copper Bonding Wire
      5.2.3 Silver Bonding Wire
      5.2.4 Palladium Coated Copper Bonding Wire
      5.2.5 Others
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global Electronics Bonding Wire Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2 Electronics Bonding Wire Market Size Forecast by Applications
      6.2.1 IC
      6.2.2 Transistor
      6.2.3 Others
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Electronics Bonding Wire Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Electronics Bonding Wire Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America Electronics Bonding Wire Analysis and Forecast
   9.1 Introduction
   9.2 North America Electronics Bonding Wire Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America Electronics Bonding Wire Market Size Forecast by Type
      9.6.1 Gold Bonding Wire
      9.6.2 Copper Bonding Wire
      9.6.3 Silver Bonding Wire
      9.6.4 Palladium Coated Copper Bonding Wire
      9.6.5 Others
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America Electronics Bonding Wire Market Size Forecast by Applications
      9.10.1 IC
      9.10.2 Transistor
      9.10.3 Others
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe Electronics Bonding Wire Analysis and Forecast
   10.1 Introduction
   10.2 Europe Electronics Bonding Wire Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe Electronics Bonding Wire Market Size Forecast by Type
      10.6.1 Gold Bonding Wire
      10.6.2 Copper Bonding Wire
      10.6.3 Silver Bonding Wire
      10.6.4 Palladium Coated Copper Bonding Wire
      10.6.5 Others
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe Electronics Bonding Wire Market Size Forecast by Applications
      10.10.1 IC
      10.10.2 Transistor
      10.10.3 Others
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific Electronics Bonding Wire Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific Electronics Bonding Wire Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific Electronics Bonding Wire Market Size Forecast by Type
      11.6.1 Gold Bonding Wire
      11.6.2 Copper Bonding Wire
      11.6.3 Silver Bonding Wire
      11.6.4 Palladium Coated Copper Bonding Wire
      11.6.5 Others
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific Electronics Bonding Wire Market Size Forecast by Applications
      11.10.1 IC
      11.10.2 Transistor
      11.10.3 Others
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America Electronics Bonding Wire Analysis and Forecast
   12.1 Introduction
   12.2 Latin America Electronics Bonding Wire Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America Electronics Bonding Wire Market Size Forecast by Type
      12.6.1 Gold Bonding Wire
      12.6.2 Copper Bonding Wire
      12.6.3 Silver Bonding Wire
      12.6.4 Palladium Coated Copper Bonding Wire
      12.6.5 Others
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America Electronics Bonding Wire Market Size Forecast by Applications
      12.10.1 IC
      12.10.2 Transistor
      12.10.3 Others
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA) Electronics Bonding Wire Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA) Electronics Bonding Wire Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA) Electronics Bonding Wire Market Size Forecast by Type
      13.6.1 Gold Bonding Wire
      13.6.2 Copper Bonding Wire
      13.6.3 Silver Bonding Wire
      13.6.4 Palladium Coated Copper Bonding Wire
      13.6.5 Others
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA) Electronics Bonding Wire Market Size Forecast by Applications
      13.10.1 IC
      13.10.2 Transistor
      13.10.3 Others
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Electronics Bonding Wire Market: Competitive Dashboard
   14.2 Global Electronics Bonding Wire Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Heraeus
      14.3.2 Tanaka
      14.3.3 Sumitomo Metal Mining
      14.3.4 MK Electron
      14.3.5 AMETEK
      14.3.6 Doublink Solders
      14.3.7 Yantai Zhaojin Kanfort
      14.3.8 Tatsuta Electric Wire & Cable
      14.3.9 Kangqiang Electronics
      14.3.10 The Prince & Izant
      14.3.11 Custom Chip Connections
      14.3.12 Yantai YesNo Electronic Materials
Segments Covered in the Report
The global Electronics Bonding Wire market has been segmented based on

By Types
  • Gold Bonding Wire
  • Copper Bonding Wire
  • Silver Bonding Wire
  • Palladium Coated Copper Bonding Wire
  • Others
By Applications
  • IC
  • Transistor
  • Others
Regions
  • Asia Pacific
  • North America
  • Latin America
  • Europe
  • Middle East & Africa
Key Players
  • Heraeus
  • Tanaka
  • Sumitomo Metal Mining
  • MK Electron
  • AMETEK
  • Doublink Solders
  • Yantai Zhaojin Kanfort
  • Tatsuta Electric Wire & Cable
  • Kangqiang Electronics
  • The Prince & Izant
  • Custom Chip Connections
  • Yantai YesNo Electronic Materials

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