Global 3D ICs Market by Type (3D Stacked ICs, 3D Monolithic ICs), by Industry Vertical (Consumer Electronics, Automotive, IT & Telecommunication, Healthcare, Aerospace & Defense), by 3D Technology (3D Wafer Level Packaging, 3D Heterogeneous Integration, 3D System-in-package), by Substrate (Bulk Silicon, Silicon on insulator [SOI]), by Component Type (Silicon Interposer, TGVs, TSVs) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028
Up Market Research published a new report titled “3D ICs Market research report which is segmented by Type (3D Stacked ICs, 3D Monolithic ICs), by Industry Vertical (Consumer Electronics, Automotive, IT & Telecommunication, Healthcare, Aerospace & Defense), by 3D Technology (3D Wafer Level Packaging, 3D Heterogeneous Integration, 3D System-in-package), by Substrate (Bulk Silicon, Silicon on insulator [SOI]), by Component Type (Silicon Interposer, TGVs, TSVs), By Players/Companies 3M Company, Micron Technology Inc. and STMicroelectronics, Monolithic 3D Inc., Tezzaron Semiconductor Corp., Intel Corp., IBM Corp., United Microelectronics Corp., Besang Inc., Xilinx Inc.”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.
Report Scope
| Report Attributes | Report Details |
| Report Title | 3D ICs Market Research Report |
| By Type | 3D Stacked ICs, 3D Monolithic ICs |
| By Industry Vertical | Consumer Electronics, Automotive, IT & Telecommunication, Healthcare, Aerospace & Defense |
| By 3D Technology | 3D Wafer Level Packaging, 3D Heterogeneous Integration, 3D System-in-package |
| By Substrate | Bulk Silicon, Silicon on insulator [SOI] |
| By Component Type | Silicon Interposer, TGVs, TSVs |
| By Companies | 3M Company, Micron Technology Inc. and STMicroelectronics, Monolithic 3D Inc., Tezzaron Semiconductor Corp., Intel Corp., IBM Corp., United Microelectronics Corp., Besang Inc., Xilinx Inc. |
| Regions Covered | North America, Europe, APAC, Latin America, MEA |
| Base Year | 2020 |
| Historical Year | 2018 to 2019 (Data from 2010 can be provided as per availability) |
| Forecast Year | 2028 |
| Number of Pages | 211 |
| Number of Tables & Figures | 148 |
| Customization Available | Yes, the report can be customized as per your need. |
The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.
Global 3D ICs Market Report Segments:
The market is segmented by Type (3D Stacked ICs, 3D Monolithic ICs), by Industry Vertical (Consumer Electronics, Automotive, IT & Telecommunication, Healthcare, Aerospace & Defense), by 3D Technology (3D Wafer Level Packaging, 3D Heterogeneous Integration, 3D System-in-package), by Substrate (Bulk Silicon, Silicon on insulator [SOI]), by Component Type (Silicon Interposer, TGVs, TSVs).
Some of the companies that are profiled in this report are:
- 3M Company
- Micron Technology Inc. and STMicroelectronics
- Monolithic 3D Inc.
- Tezzaron Semiconductor Corp.
- Intel Corp.
- IBM Corp.
- United Microelectronics Corp.
- Besang Inc.
- Xilinx Inc.
3D ICs Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.
Key Benefits for Industry Participants & Stakeholders:
- Industry drivers, restraints, and opportunities covered in the study
- Neutral perspective on the market performance
- Recent industry trends and developments
- Competitive landscape & strategies of key players
- Potential & niche segments and regions exhibiting promising growth covered
- Historical, current, and projected market size, in terms of value
- In-depth analysis of the 3D ICs Market
Overview of the regional outlook of the 3D ICs Market:
Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.
Highlights of The 3D ICs Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of 3D ICs Market.
- Historical data and forecast.
- Estimations for the forecast period 2028.
- Developments and trends in the market.
1. 3D Stacked ICs
2. 3D Monolithic ICs
7. By Industry Vertical:1. Consumer Electronics
2. Automotive
3. IT & Telecommunication
4. Healthcare
5. Aerospace & Defense
8. By 3D Technology:1. 3D Wafer Level Packaging
2. 3D Heterogeneous Integration
3. 3D System-in-package
9. By Substrate:1. Bulk Silicon
2. Silicon on insulator [SOI]
10. By Component Type:1. Silicon Interposer
2. TGVs
3. TSVs
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the 3D ICs Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
Reasons to Purchase the 3D ICs Market Report:
- The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
- Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
- Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
- The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
- Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 3D ICs Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 3D ICs Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 3D ICs Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 3D ICs Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 3D ICs Market Size & Forecast, 2018-2028
4.5.1 3D ICs Market Size and Y-o-Y Growth
4.5.2 3D ICs Market Absolute $ Opportunity
Chapter 5 Global 3D ICs Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 3D ICs Market Size Forecast by Type
5.2.1 3D Stacked ICs
5.2.2 3D Monolithic ICs
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 3D ICs Market Analysis and Forecast by Industry Vertical
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
6.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
6.1.3 Absolute $ Opportunity Assessment by Industry Vertical
6.2 3D ICs Market Size Forecast by Industry Vertical
6.2.1 Consumer Electronics
6.2.2 Automotive
6.2.3 IT & Telecommunication
6.2.4 Healthcare
6.2.5 Aerospace & Defense
6.3 Market Attractiveness Analysis by Industry Vertical
Chapter 7 Global 3D ICs Market Analysis and Forecast by 3D Technology
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by 3D Technology
7.1.2 Basis Point Share (BPS) Analysis by 3D Technology
7.1.3 Absolute $ Opportunity Assessment by 3D Technology
7.2 3D ICs Market Size Forecast by 3D Technology
7.2.1 3D Wafer Level Packaging
7.2.2 3D Heterogeneous Integration
7.2.3 3D System-in-package
7.3 Market Attractiveness Analysis by 3D Technology
Chapter 8 Global 3D ICs Market Analysis and Forecast by Substrate
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Substrate
8.1.2 Basis Point Share (BPS) Analysis by Substrate
8.1.3 Absolute $ Opportunity Assessment by Substrate
8.2 3D ICs Market Size Forecast by Substrate
8.2.1 Bulk Silicon
8.2.2 Silicon on insulator [SOI]
8.3 Market Attractiveness Analysis by Substrate
Chapter 9 Global 3D ICs Market Analysis and Forecast by Component Type
9.1 Introduction
9.1.1 Key Market Trends & Growth Opportunities by Component Type
9.1.2 Basis Point Share (BPS) Analysis by Component Type
9.1.3 Absolute $ Opportunity Assessment by Component Type
9.2 3D ICs Market Size Forecast by Component Type
9.2.1 Silicon Interposer
9.2.2 TGVs
9.2.3 TSVs
9.3 Market Attractiveness Analysis by Component Type
Chapter 10 Global 3D ICs Market Analysis and Forecast by Region
10.1 Introduction
10.1.1 Key Market Trends & Growth Opportunities by Region
10.1.2 Basis Point Share (BPS) Analysis by Region
10.1.3 Absolute $ Opportunity Assessment by Region
10.2 3D ICs Market Size Forecast by Region
10.2.1 North America
10.2.2 Europe
10.2.3 Asia Pacific
10.2.4 Latin America
10.2.5 Middle East & Africa (MEA)
10.3 Market Attractiveness Analysis by Region
Chapter 11 Coronavirus Disease (COVID-19) Impact
11.1 Introduction
11.2 Current & Future Impact Analysis
11.3 Economic Impact Analysis
11.4 Government Policies
11.5 Investment Scenario
Chapter 12 North America 3D ICs Analysis and Forecast
12.1 Introduction
12.2 North America 3D ICs Market Size Forecast by Country
12.2.1 U.S.
12.2.2 Canada
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 North America 3D ICs Market Size Forecast by Type
12.6.1 3D Stacked ICs
12.6.2 3D Monolithic ICs
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 North America 3D ICs Market Size Forecast by Industry Vertical
12.10.1 Consumer Electronics
12.10.2 Automotive
12.10.3 IT & Telecommunication
12.10.4 Healthcare
12.10.5 Aerospace & Defense
12.11 Basis Point Share (BPS) Analysis by Industry Vertical
12.12 Absolute $ Opportunity Assessment by Industry Vertical
12.13 Market Attractiveness Analysis by Industry Vertical
12.14 North America 3D ICs Market Size Forecast by 3D Technology
12.14.1 3D Wafer Level Packaging
12.14.2 3D Heterogeneous Integration
12.14.3 3D System-in-package
12.15 Basis Point Share (BPS) Analysis by 3D Technology
12.16 Absolute $ Opportunity Assessment by 3D Technology
12.17 Market Attractiveness Analysis by 3D Technology
12.18 North America 3D ICs Market Size Forecast by Substrate
12.18.1 Bulk Silicon
12.18.2 Silicon on insulator [SOI]
12.19 Basis Point Share (BPS) Analysis by Substrate
12.20 Absolute $ Opportunity Assessment by Substrate
12.21 Market Attractiveness Analysis by Substrate
12.22 North America 3D ICs Market Size Forecast by Component Type
12.22.1 Silicon Interposer
12.22.2 TGVs
12.22.3 TSVs
12.23 Basis Point Share (BPS) Analysis by Component Type
12.24 Absolute $ Opportunity Assessment by Component Type
12.25 Market Attractiveness Analysis by Component Type
Chapter 13 Europe 3D ICs Analysis and Forecast
13.1 Introduction
13.2 Europe 3D ICs Market Size Forecast by Country
13.2.1 Germany
13.2.2 France
13.2.3 Italy
13.2.4 U.K.
13.2.5 Spain
13.2.6 Russia
13.2.7 Rest of Europe
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Europe 3D ICs Market Size Forecast by Type
13.6.1 3D Stacked ICs
13.6.2 3D Monolithic ICs
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Europe 3D ICs Market Size Forecast by Industry Vertical
13.10.1 Consumer Electronics
13.10.2 Automotive
13.10.3 IT & Telecommunication
13.10.4 Healthcare
13.10.5 Aerospace & Defense
13.11 Basis Point Share (BPS) Analysis by Industry Vertical
13.12 Absolute $ Opportunity Assessment by Industry Vertical
13.13 Market Attractiveness Analysis by Industry Vertical
13.14 Europe 3D ICs Market Size Forecast by 3D Technology
13.14.1 3D Wafer Level Packaging
13.14.2 3D Heterogeneous Integration
13.14.3 3D System-in-package
13.15 Basis Point Share (BPS) Analysis by 3D Technology
13.16 Absolute $ Opportunity Assessment by 3D Technology
13.17 Market Attractiveness Analysis by 3D Technology
13.18 Europe 3D ICs Market Size Forecast by Substrate
13.18.1 Bulk Silicon
13.18.2 Silicon on insulator [SOI]
13.19 Basis Point Share (BPS) Analysis by Substrate
13.20 Absolute $ Opportunity Assessment by Substrate
13.21 Market Attractiveness Analysis by Substrate
13.22 Europe 3D ICs Market Size Forecast by Component Type
13.22.1 Silicon Interposer
13.22.2 TGVs
13.22.3 TSVs
13.23 Basis Point Share (BPS) Analysis by Component Type
13.24 Absolute $ Opportunity Assessment by Component Type
13.25 Market Attractiveness Analysis by Component Type
Chapter 14 Asia Pacific 3D ICs Analysis and Forecast
14.1 Introduction
14.2 Asia Pacific 3D ICs Market Size Forecast by Country
14.2.1 China
14.2.2 Japan
14.2.3 South Korea
14.2.4 India
14.2.5 Australia
14.2.6 South East Asia (SEA)
14.2.7 Rest of Asia Pacific (APAC)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Asia Pacific 3D ICs Market Size Forecast by Type
14.6.1 3D Stacked ICs
14.6.2 3D Monolithic ICs
14.7 Basis Point Share (BPS) Analysis by Type
14.8 Absolute $ Opportunity Assessment by Type
14.9 Market Attractiveness Analysis by Type
14.10 Asia Pacific 3D ICs Market Size Forecast by Industry Vertical
14.10.1 Consumer Electronics
14.10.2 Automotive
14.10.3 IT & Telecommunication
14.10.4 Healthcare
14.10.5 Aerospace & Defense
14.11 Basis Point Share (BPS) Analysis by Industry Vertical
14.12 Absolute $ Opportunity Assessment by Industry Vertical
14.13 Market Attractiveness Analysis by Industry Vertical
14.14 Asia Pacific 3D ICs Market Size Forecast by 3D Technology
14.14.1 3D Wafer Level Packaging
14.14.2 3D Heterogeneous Integration
14.14.3 3D System-in-package
14.15 Basis Point Share (BPS) Analysis by 3D Technology
14.16 Absolute $ Opportunity Assessment by 3D Technology
14.17 Market Attractiveness Analysis by 3D Technology
14.18 Asia Pacific 3D ICs Market Size Forecast by Substrate
14.18.1 Bulk Silicon
14.18.2 Silicon on insulator [SOI]
14.19 Basis Point Share (BPS) Analysis by Substrate
14.20 Absolute $ Opportunity Assessment by Substrate
14.21 Market Attractiveness Analysis by Substrate
14.22 Asia Pacific 3D ICs Market Size Forecast by Component Type
14.22.1 Silicon Interposer
14.22.2 TGVs
14.22.3 TSVs
14.23 Basis Point Share (BPS) Analysis by Component Type
14.24 Absolute $ Opportunity Assessment by Component Type
14.25 Market Attractiveness Analysis by Component Type
Chapter 15 Latin America 3D ICs Analysis and Forecast
15.1 Introduction
15.2 Latin America 3D ICs Market Size Forecast by Country
15.2.1 Brazil
15.2.2 Mexico
15.2.3 Rest of Latin America (LATAM)
15.3 Basis Point Share (BPS) Analysis by Country
15.4 Absolute $ Opportunity Assessment by Country
15.5 Market Attractiveness Analysis by Country
15.6 Latin America 3D ICs Market Size Forecast by Type
15.6.1 3D Stacked ICs
15.6.2 3D Monolithic ICs
15.7 Basis Point Share (BPS) Analysis by Type
15.8 Absolute $ Opportunity Assessment by Type
15.9 Market Attractiveness Analysis by Type
15.10 Latin America 3D ICs Market Size Forecast by Industry Vertical
15.10.1 Consumer Electronics
15.10.2 Automotive
15.10.3 IT & Telecommunication
15.10.4 Healthcare
15.10.5 Aerospace & Defense
15.11 Basis Point Share (BPS) Analysis by Industry Vertical
15.12 Absolute $ Opportunity Assessment by Industry Vertical
15.13 Market Attractiveness Analysis by Industry Vertical
15.14 Latin America 3D ICs Market Size Forecast by 3D Technology
15.14.1 3D Wafer Level Packaging
15.14.2 3D Heterogeneous Integration
15.14.3 3D System-in-package
15.15 Basis Point Share (BPS) Analysis by 3D Technology
15.16 Absolute $ Opportunity Assessment by 3D Technology
15.17 Market Attractiveness Analysis by 3D Technology
15.18 Latin America 3D ICs Market Size Forecast by Substrate
15.18.1 Bulk Silicon
15.18.2 Silicon on insulator [SOI]
15.19 Basis Point Share (BPS) Analysis by Substrate
15.20 Absolute $ Opportunity Assessment by Substrate
15.21 Market Attractiveness Analysis by Substrate
15.22 Latin America 3D ICs Market Size Forecast by Component Type
15.22.1 Silicon Interposer
15.22.2 TGVs
15.22.3 TSVs
15.23 Basis Point Share (BPS) Analysis by Component Type
15.24 Absolute $ Opportunity Assessment by Component Type
15.25 Market Attractiveness Analysis by Component Type
Chapter 16 Middle East & Africa (MEA) 3D ICs Analysis and Forecast
16.1 Introduction
16.2 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Country
16.2.1 Saudi Arabia
16.2.2 South Africa
16.2.3 UAE
16.2.4 Rest of Middle East & Africa (MEA)
16.3 Basis Point Share (BPS) Analysis by Country
16.4 Absolute $ Opportunity Assessment by Country
16.5 Market Attractiveness Analysis by Country
16.6 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Type
16.6.1 3D Stacked ICs
16.6.2 3D Monolithic ICs
16.7 Basis Point Share (BPS) Analysis by Type
16.8 Absolute $ Opportunity Assessment by Type
16.9 Market Attractiveness Analysis by Type
16.10 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Industry Vertical
16.10.1 Consumer Electronics
16.10.2 Automotive
16.10.3 IT & Telecommunication
16.10.4 Healthcare
16.10.5 Aerospace & Defense
16.11 Basis Point Share (BPS) Analysis by Industry Vertical
16.12 Absolute $ Opportunity Assessment by Industry Vertical
16.13 Market Attractiveness Analysis by Industry Vertical
16.14 Middle East & Africa (MEA) 3D ICs Market Size Forecast by 3D Technology
16.14.1 3D Wafer Level Packaging
16.14.2 3D Heterogeneous Integration
16.14.3 3D System-in-package
16.15 Basis Point Share (BPS) Analysis by 3D Technology
16.16 Absolute $ Opportunity Assessment by 3D Technology
16.17 Market Attractiveness Analysis by 3D Technology
16.18 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Substrate
16.18.1 Bulk Silicon
16.18.2 Silicon on insulator [SOI]
16.19 Basis Point Share (BPS) Analysis by Substrate
16.20 Absolute $ Opportunity Assessment by Substrate
16.21 Market Attractiveness Analysis by Substrate
16.22 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Component Type
16.22.1 Silicon Interposer
16.22.2 TGVs
16.22.3 TSVs
16.23 Basis Point Share (BPS) Analysis by Component Type
16.24 Absolute $ Opportunity Assessment by Component Type
16.25 Market Attractiveness Analysis by Component Type
Chapter 17 Competition Landscape
17.1 3D ICs Market: Competitive Dashboard
17.2 Global 3D ICs Market: Market Share Analysis, 2019
17.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
17.3.1 3M Company
17.3.2 Micron Technology Inc. and STMicroelectronics
17.3.3 Monolithic 3D Inc.
17.3.4 Tezzaron Semiconductor Corp.
17.3.5 Intel Corp.
17.3.6 IBM Corp.
17.3.7 United Microelectronics Corp.
17.3.8 Besang Inc.
17.3.9 Xilinx Inc.
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 3D ICs Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 3D ICs Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 3D ICs Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the 3D ICs Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global 3D ICs Market Size & Forecast, 2018-2028
4.5.1 3D ICs Market Size and Y-o-Y Growth
4.5.2 3D ICs Market Absolute $ Opportunity
Chapter 5 Global 3D ICs Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 3D ICs Market Size Forecast by Type
5.2.1 3D Stacked ICs
5.2.2 3D Monolithic ICs
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global 3D ICs Market Analysis and Forecast by Industry Vertical
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Industry Vertical
6.1.2 Basis Point Share (BPS) Analysis by Industry Vertical
6.1.3 Absolute $ Opportunity Assessment by Industry Vertical
6.2 3D ICs Market Size Forecast by Industry Vertical
6.2.1 Consumer Electronics
6.2.2 Automotive
6.2.3 IT & Telecommunication
6.2.4 Healthcare
6.2.5 Aerospace & Defense
6.3 Market Attractiveness Analysis by Industry Vertical
Chapter 7 Global 3D ICs Market Analysis and Forecast by 3D Technology
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by 3D Technology
7.1.2 Basis Point Share (BPS) Analysis by 3D Technology
7.1.3 Absolute $ Opportunity Assessment by 3D Technology
7.2 3D ICs Market Size Forecast by 3D Technology
7.2.1 3D Wafer Level Packaging
7.2.2 3D Heterogeneous Integration
7.2.3 3D System-in-package
7.3 Market Attractiveness Analysis by 3D Technology
Chapter 8 Global 3D ICs Market Analysis and Forecast by Substrate
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Substrate
8.1.2 Basis Point Share (BPS) Analysis by Substrate
8.1.3 Absolute $ Opportunity Assessment by Substrate
8.2 3D ICs Market Size Forecast by Substrate
8.2.1 Bulk Silicon
8.2.2 Silicon on insulator [SOI]
8.3 Market Attractiveness Analysis by Substrate
Chapter 9 Global 3D ICs Market Analysis and Forecast by Component Type
9.1 Introduction
9.1.1 Key Market Trends & Growth Opportunities by Component Type
9.1.2 Basis Point Share (BPS) Analysis by Component Type
9.1.3 Absolute $ Opportunity Assessment by Component Type
9.2 3D ICs Market Size Forecast by Component Type
9.2.1 Silicon Interposer
9.2.2 TGVs
9.2.3 TSVs
9.3 Market Attractiveness Analysis by Component Type
Chapter 10 Global 3D ICs Market Analysis and Forecast by Region
10.1 Introduction
10.1.1 Key Market Trends & Growth Opportunities by Region
10.1.2 Basis Point Share (BPS) Analysis by Region
10.1.3 Absolute $ Opportunity Assessment by Region
10.2 3D ICs Market Size Forecast by Region
10.2.1 North America
10.2.2 Europe
10.2.3 Asia Pacific
10.2.4 Latin America
10.2.5 Middle East & Africa (MEA)
10.3 Market Attractiveness Analysis by Region
Chapter 11 Coronavirus Disease (COVID-19) Impact
11.1 Introduction
11.2 Current & Future Impact Analysis
11.3 Economic Impact Analysis
11.4 Government Policies
11.5 Investment Scenario
Chapter 12 North America 3D ICs Analysis and Forecast
12.1 Introduction
12.2 North America 3D ICs Market Size Forecast by Country
12.2.1 U.S.
12.2.2 Canada
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 North America 3D ICs Market Size Forecast by Type
12.6.1 3D Stacked ICs
12.6.2 3D Monolithic ICs
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 North America 3D ICs Market Size Forecast by Industry Vertical
12.10.1 Consumer Electronics
12.10.2 Automotive
12.10.3 IT & Telecommunication
12.10.4 Healthcare
12.10.5 Aerospace & Defense
12.11 Basis Point Share (BPS) Analysis by Industry Vertical
12.12 Absolute $ Opportunity Assessment by Industry Vertical
12.13 Market Attractiveness Analysis by Industry Vertical
12.14 North America 3D ICs Market Size Forecast by 3D Technology
12.14.1 3D Wafer Level Packaging
12.14.2 3D Heterogeneous Integration
12.14.3 3D System-in-package
12.15 Basis Point Share (BPS) Analysis by 3D Technology
12.16 Absolute $ Opportunity Assessment by 3D Technology
12.17 Market Attractiveness Analysis by 3D Technology
12.18 North America 3D ICs Market Size Forecast by Substrate
12.18.1 Bulk Silicon
12.18.2 Silicon on insulator [SOI]
12.19 Basis Point Share (BPS) Analysis by Substrate
12.20 Absolute $ Opportunity Assessment by Substrate
12.21 Market Attractiveness Analysis by Substrate
12.22 North America 3D ICs Market Size Forecast by Component Type
12.22.1 Silicon Interposer
12.22.2 TGVs
12.22.3 TSVs
12.23 Basis Point Share (BPS) Analysis by Component Type
12.24 Absolute $ Opportunity Assessment by Component Type
12.25 Market Attractiveness Analysis by Component Type
Chapter 13 Europe 3D ICs Analysis and Forecast
13.1 Introduction
13.2 Europe 3D ICs Market Size Forecast by Country
13.2.1 Germany
13.2.2 France
13.2.3 Italy
13.2.4 U.K.
13.2.5 Spain
13.2.6 Russia
13.2.7 Rest of Europe
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Europe 3D ICs Market Size Forecast by Type
13.6.1 3D Stacked ICs
13.6.2 3D Monolithic ICs
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Europe 3D ICs Market Size Forecast by Industry Vertical
13.10.1 Consumer Electronics
13.10.2 Automotive
13.10.3 IT & Telecommunication
13.10.4 Healthcare
13.10.5 Aerospace & Defense
13.11 Basis Point Share (BPS) Analysis by Industry Vertical
13.12 Absolute $ Opportunity Assessment by Industry Vertical
13.13 Market Attractiveness Analysis by Industry Vertical
13.14 Europe 3D ICs Market Size Forecast by 3D Technology
13.14.1 3D Wafer Level Packaging
13.14.2 3D Heterogeneous Integration
13.14.3 3D System-in-package
13.15 Basis Point Share (BPS) Analysis by 3D Technology
13.16 Absolute $ Opportunity Assessment by 3D Technology
13.17 Market Attractiveness Analysis by 3D Technology
13.18 Europe 3D ICs Market Size Forecast by Substrate
13.18.1 Bulk Silicon
13.18.2 Silicon on insulator [SOI]
13.19 Basis Point Share (BPS) Analysis by Substrate
13.20 Absolute $ Opportunity Assessment by Substrate
13.21 Market Attractiveness Analysis by Substrate
13.22 Europe 3D ICs Market Size Forecast by Component Type
13.22.1 Silicon Interposer
13.22.2 TGVs
13.22.3 TSVs
13.23 Basis Point Share (BPS) Analysis by Component Type
13.24 Absolute $ Opportunity Assessment by Component Type
13.25 Market Attractiveness Analysis by Component Type
Chapter 14 Asia Pacific 3D ICs Analysis and Forecast
14.1 Introduction
14.2 Asia Pacific 3D ICs Market Size Forecast by Country
14.2.1 China
14.2.2 Japan
14.2.3 South Korea
14.2.4 India
14.2.5 Australia
14.2.6 South East Asia (SEA)
14.2.7 Rest of Asia Pacific (APAC)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Asia Pacific 3D ICs Market Size Forecast by Type
14.6.1 3D Stacked ICs
14.6.2 3D Monolithic ICs
14.7 Basis Point Share (BPS) Analysis by Type
14.8 Absolute $ Opportunity Assessment by Type
14.9 Market Attractiveness Analysis by Type
14.10 Asia Pacific 3D ICs Market Size Forecast by Industry Vertical
14.10.1 Consumer Electronics
14.10.2 Automotive
14.10.3 IT & Telecommunication
14.10.4 Healthcare
14.10.5 Aerospace & Defense
14.11 Basis Point Share (BPS) Analysis by Industry Vertical
14.12 Absolute $ Opportunity Assessment by Industry Vertical
14.13 Market Attractiveness Analysis by Industry Vertical
14.14 Asia Pacific 3D ICs Market Size Forecast by 3D Technology
14.14.1 3D Wafer Level Packaging
14.14.2 3D Heterogeneous Integration
14.14.3 3D System-in-package
14.15 Basis Point Share (BPS) Analysis by 3D Technology
14.16 Absolute $ Opportunity Assessment by 3D Technology
14.17 Market Attractiveness Analysis by 3D Technology
14.18 Asia Pacific 3D ICs Market Size Forecast by Substrate
14.18.1 Bulk Silicon
14.18.2 Silicon on insulator [SOI]
14.19 Basis Point Share (BPS) Analysis by Substrate
14.20 Absolute $ Opportunity Assessment by Substrate
14.21 Market Attractiveness Analysis by Substrate
14.22 Asia Pacific 3D ICs Market Size Forecast by Component Type
14.22.1 Silicon Interposer
14.22.2 TGVs
14.22.3 TSVs
14.23 Basis Point Share (BPS) Analysis by Component Type
14.24 Absolute $ Opportunity Assessment by Component Type
14.25 Market Attractiveness Analysis by Component Type
Chapter 15 Latin America 3D ICs Analysis and Forecast
15.1 Introduction
15.2 Latin America 3D ICs Market Size Forecast by Country
15.2.1 Brazil
15.2.2 Mexico
15.2.3 Rest of Latin America (LATAM)
15.3 Basis Point Share (BPS) Analysis by Country
15.4 Absolute $ Opportunity Assessment by Country
15.5 Market Attractiveness Analysis by Country
15.6 Latin America 3D ICs Market Size Forecast by Type
15.6.1 3D Stacked ICs
15.6.2 3D Monolithic ICs
15.7 Basis Point Share (BPS) Analysis by Type
15.8 Absolute $ Opportunity Assessment by Type
15.9 Market Attractiveness Analysis by Type
15.10 Latin America 3D ICs Market Size Forecast by Industry Vertical
15.10.1 Consumer Electronics
15.10.2 Automotive
15.10.3 IT & Telecommunication
15.10.4 Healthcare
15.10.5 Aerospace & Defense
15.11 Basis Point Share (BPS) Analysis by Industry Vertical
15.12 Absolute $ Opportunity Assessment by Industry Vertical
15.13 Market Attractiveness Analysis by Industry Vertical
15.14 Latin America 3D ICs Market Size Forecast by 3D Technology
15.14.1 3D Wafer Level Packaging
15.14.2 3D Heterogeneous Integration
15.14.3 3D System-in-package
15.15 Basis Point Share (BPS) Analysis by 3D Technology
15.16 Absolute $ Opportunity Assessment by 3D Technology
15.17 Market Attractiveness Analysis by 3D Technology
15.18 Latin America 3D ICs Market Size Forecast by Substrate
15.18.1 Bulk Silicon
15.18.2 Silicon on insulator [SOI]
15.19 Basis Point Share (BPS) Analysis by Substrate
15.20 Absolute $ Opportunity Assessment by Substrate
15.21 Market Attractiveness Analysis by Substrate
15.22 Latin America 3D ICs Market Size Forecast by Component Type
15.22.1 Silicon Interposer
15.22.2 TGVs
15.22.3 TSVs
15.23 Basis Point Share (BPS) Analysis by Component Type
15.24 Absolute $ Opportunity Assessment by Component Type
15.25 Market Attractiveness Analysis by Component Type
Chapter 16 Middle East & Africa (MEA) 3D ICs Analysis and Forecast
16.1 Introduction
16.2 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Country
16.2.1 Saudi Arabia
16.2.2 South Africa
16.2.3 UAE
16.2.4 Rest of Middle East & Africa (MEA)
16.3 Basis Point Share (BPS) Analysis by Country
16.4 Absolute $ Opportunity Assessment by Country
16.5 Market Attractiveness Analysis by Country
16.6 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Type
16.6.1 3D Stacked ICs
16.6.2 3D Monolithic ICs
16.7 Basis Point Share (BPS) Analysis by Type
16.8 Absolute $ Opportunity Assessment by Type
16.9 Market Attractiveness Analysis by Type
16.10 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Industry Vertical
16.10.1 Consumer Electronics
16.10.2 Automotive
16.10.3 IT & Telecommunication
16.10.4 Healthcare
16.10.5 Aerospace & Defense
16.11 Basis Point Share (BPS) Analysis by Industry Vertical
16.12 Absolute $ Opportunity Assessment by Industry Vertical
16.13 Market Attractiveness Analysis by Industry Vertical
16.14 Middle East & Africa (MEA) 3D ICs Market Size Forecast by 3D Technology
16.14.1 3D Wafer Level Packaging
16.14.2 3D Heterogeneous Integration
16.14.3 3D System-in-package
16.15 Basis Point Share (BPS) Analysis by 3D Technology
16.16 Absolute $ Opportunity Assessment by 3D Technology
16.17 Market Attractiveness Analysis by 3D Technology
16.18 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Substrate
16.18.1 Bulk Silicon
16.18.2 Silicon on insulator [SOI]
16.19 Basis Point Share (BPS) Analysis by Substrate
16.20 Absolute $ Opportunity Assessment by Substrate
16.21 Market Attractiveness Analysis by Substrate
16.22 Middle East & Africa (MEA) 3D ICs Market Size Forecast by Component Type
16.22.1 Silicon Interposer
16.22.2 TGVs
16.22.3 TSVs
16.23 Basis Point Share (BPS) Analysis by Component Type
16.24 Absolute $ Opportunity Assessment by Component Type
16.25 Market Attractiveness Analysis by Component Type
Chapter 17 Competition Landscape
17.1 3D ICs Market: Competitive Dashboard
17.2 Global 3D ICs Market: Market Share Analysis, 2019
17.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
17.3.1 3M Company
17.3.2 Micron Technology Inc. and STMicroelectronics
17.3.3 Monolithic 3D Inc.
17.3.4 Tezzaron Semiconductor Corp.
17.3.5 Intel Corp.
17.3.6 IBM Corp.
17.3.7 United Microelectronics Corp.
17.3.8 Besang Inc.
17.3.9 Xilinx Inc.
Segments Covered in the Report
The global 3D ICs market has been segmented based on
By Type
The global 3D ICs market has been segmented based on
By Type
- 3D Stacked ICs
- 3D Monolithic ICs
- Consumer Electronics
- Automotive
- IT & Telecommunication
- Healthcare
- Aerospace & Defense
- 3D Wafer Level Packaging
- 3D Heterogeneous Integration
- 3D System-in-package
- Bulk Silicon
- Silicon on insulator [SOI]
- Silicon Interposer
- TGVs
- TSVs
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
- 3M Company
- Micron Technology Inc. and STMicroelectronics
- Monolithic 3D Inc.
- Tezzaron Semiconductor Corp.
- Intel Corp.
- IBM Corp.
- United Microelectronics Corp.
- Besang Inc.
- Xilinx Inc.
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